ZHCSJ98J NOVEMBER   2006  – January 2019 TS3USB221

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      框图
      2.      每个 FET 开关 (SW) 的简化原理图)
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Dynamic Electrical Characteristics, VCC = 3.3 V ± 10%
    7. 6.7  Dynamic Electrical Characteristics, VCC = 2.5 V ± 10%
    8. 6.8  Switching Characteristics, VCC = 3.3 V ± 10%
    9. 6.9  Switching Characteristics, VCC = 2.5 V ± 10%
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Low Power Mode
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) TS3USB221 UNIT
DRC (VSON) RSE (UQFN)
10 PINS 10 PINS
RθJA Junction-to-ambient thermal resistance 57.7 169.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 87.7 84.7
RθJB Junction-to-board thermal resistance 32.6 94.9
ψJT Junction-to-top characterization parameter 8.2 5.7
ψJB Junction-to-board characterization parameter 32.8 94.9
RθJC(bot) Junction-to-case (bottom) thermal resistance 18.5 N/A
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.