ZHCSFS7B December   2016  – July 2017 TPSM84A22

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Package Specifications
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Adjusting the Output Voltage (VADJ)
      2. 7.3.2  Input and Output Capacitance
      3. 7.3.3  Transient Response
        1. 7.3.3.1 Transient Response Waveforms
      4. 7.3.4  Oscillator Frequency
      5. 7.3.5  External Clock Syncronization
      6. 7.3.6  Soft Start
      7. 7.3.7  Power Good (PGOOD)
      8. 7.3.8  Gate Driver (VG)
      9. 7.3.9  Startup into Pre-biased Outputs
      10. 7.3.10 Thermal Shutdown
      11. 7.3.11 Overcurrent Protection
      12. 7.3.12 Output Undervoltage/Overvoltage Protection
      13. 7.3.13 Enable (EN)
      14. 7.3.14 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
      2. 7.4.2 Light Load Operation
      3. 7.4.3 Shutdown Mode
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting the Output Voltage
        2. 8.2.2.2 Input and Output Capacitance
        3. 8.2.2.3 Power Good (PGOOD)
        4. 8.2.2.4 External VG Voltage
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 EMI
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

修订历史记录

Changes from A Revision (April 2017) to B Revision

  • 删除特性 MSL 3/260°C 峰值回流(请参阅封装选项附录)Go
  • Added the EMI sectionGo

Changes from * Revision (December 2016) to A Revision

  • 将最大回流温度从 245C 更改为 260C Go