ZHCSCM9 May   2014 TPS92410

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Setting the Linear Regulator Current/Input Power (CS)
      2. 7.3.2  Over-Voltage Protecton (DOV)
      3. 7.3.3  Input Undervoltage Lockout (UVLO)
      4. 7.3.4  Reference Voltage (VREF)
      5. 7.3.5  Forward Phase Dimmer Detection (CPS, CDD)
      6. 7.3.6  Analog Dimming Input and Setting VCS (ADIM)
      7. 7.3.7  Thermal Foldback (TSNS)
      8. 7.3.8  Internal Regulator (VCC)
      9. 7.3.9  Error Amplifier (COMP)
      10. 7.3.10 Linear MOSFET Gate Drive (GDL)
      11. 7.3.11 EMI Filter
      12. 7.3.12 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Multiplier Mode
      2. 7.4.2 Dimmer Detect Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 120-VAC Input, 6.6-W LED Driver
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
      2. 8.2.2 230-VAC Input, 11-W LED Driver
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 商标
    2. 11.2 静电放电警告
    3. 11.3 术语表
  12. 12机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Input voltage VIN –0.3 700 V
Output voltage VCC –0.3 18 V
GDL –0.3 18
MULT, VREF, ADIM, COMP, CPS, CDD, TSNS –0.3 7.7
DOV –0.3 6
Source current CS 1 mA
Sink current CS 1 mA
Operating junction temperature, TJ(2) –40 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Maximum junction temperature is internally limited by the device.

6.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
V(ESD)(1) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(2) –1 1 kV
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(3) –250 250 V
(1) Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges into the device.
(2) Level listed above is the passing level per ANSI/ESDA/JEDEC JS-001. JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process. Terminals listed as 1000V may actually have higher performance.
(3) Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process. Terminals listed as 250V may actually have higher performance.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN Input voltage 9.5 450 V
VMULT Multiplier peak input voltage 3 V
VADIM Analog dimming input voltage 0 3 V
TJ Operating junction temperature -40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) TPS92410 UNIT
D (13)
RθJA Junction-to-ambient thermal resistance 84.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 39.8
RθJB Junction-to-board thermal resistance 39.5
ψJT Junction-to-top characterization parameter 8.9
ψJB Junction-to-board characterization parameter 39.0
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

–40°C ≤ TJ ≤ 125°C, VVIN = 100 V, VADIM = VMULT = 1 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY VOLTAGE (VIN)
VCC Pre-regulator output voltage 10.15 V
VCCUVLO Supply votlage undervoltage protection Rising threshold, VVIN = VVCC 8 8.3 V
Falling threshold, VVIN = VVCC 5 5.85
Hysteresis 2.15
IVIN Input voltage bias current VVCC = 12 V 2.5 50 μA
IVCC Supply bias current 305 500 μA
Supply standby current VVIN = 0 V, VVCC = 7 V (UVLO) 145
IVCCLIM VCC supply current limit VVCC = 7.5 V 8 25 mA
Tplh(UVLO) VCC supply glitch filter rising VVCC stepped from 6.075 V to 110% of VCCUVLO,rising 16.2 μs
MULTIPLIER (MULT)
VMULT,LINEAR Multiplier linear range 0 3.5 V
VCOMP,LINEAR COMP pin linear range 1.5 3.25 V
RMULT Input impedance 500 580 700 kΩ
AMULT Multiplier gain VMULT = 1.5 V, VCOMP = 2.25 V,
k = VMULT_OUT/[(VCOMP–1.5 V) × VMULT]		 0.95 1.43 1.85 1/V
VMULT,OFFSET Multiplier output offset VMULT = 0 V, VCOMP = 2.25 V 13.7 mV
MULTOUT,mx Multiplier Output Clamp Voltage VADIM = VTSNS = open; VCOMP = 4 V, VMULT = 3.5 V 2.25 2.43 2.65 V
VOLTAGE REFERENCE (VREF)
VVREF Reference voltage IVREF = 100 μA 2.85 3 3.15 V
VREFLINE Line regulation 8.5 V ≤ VVIN ≤ 100 V 1%
VREFLOAD Load regulation 10 μA ≤ IREF ≤ 200 μA 1%
TRANSCONDUCTANCE AMPLIFIER (ADIM, COMP)
ADIMLIM ADIM operating voltage limit 1.425 1.5 1.575 V
IADIM Pull-up current 0.5 1 μA
ADIMSD ADIM linear shutdown threshold Falling 18 40 70 mV
ADIMSD,HYS ADIM shutdown hysteresis 20 mV
gM Transconductance 43.3 μS
VOFFSET Input offset voltage VADIM = 0.5 V -20 20 mV
IOUT,SOURCE Output source current VCOMP = 2.25 V, VMULT = 0V,
VADIM = VTSNS = 2 V		 65 μA
IOUT,SINK Output sink current VCOMP = 2.25 V, VTSNS = 0 V 75
ISTART VCOMP = 0 V, VADIM = 0 V 485
DIMMER DETECT (MULT, CPS, CDD)
ICPS Charge current for CPS pin 6.7 10 13.3 μA
ICDD,c Charge current for CDD pin 5.7 10 13.3
ICDD,d Discharge current for CDD pin 0.67 1 1.33
Dv/Dt Maximum detection threshold VMULT stepped from 0 V to 1 V, minimum slew rate required 1/100 V/μs
VOFFSET Detector offset voltage 0.41 V
VTH,CDD CDD threshold 1.5
VTH,CPS CPS threshold 1.5
RCSP Pull down RDS(on) 314 Ω
DRAIN OVER-VOLTAGE (DOV)
VTH,DOV Drain over-voltage threshold 1.38 1.5 1.62 V
VHYS,DOV Internal DOV hysteresis 20 mV
IHYS,DOV Drain over-voltage source current VDOV = 1.5 V, Device in over-voltage mode 0.7 1 1.5 μA
VREF,DOV Linear CS reference during over-voltage VDOV = 1.75 V 0.1 V
THERMAL FOLDBACK (TSNS)
TSNSLIM TSNS operating voltage limit 1.425 1.5 1.575 V
VADIM = VTSNS = 1 V, Measure reference to the linear error amplifier 2.1 mV
VTSNS = 0 V, Measure reference to the linear error amplifier 3.6
ITSNS Pull-up current 0.5 1 µA
LINEAR CURRENT SENSE (CS)
VCS(max) CS voltage level (CC dimming mode) 2.5 V = VADIM = VTSNS 1.425 1.5 1.575 V
VCS(max) CS voltage level (PFC mode) 2.5 V = VADIM = VTSNS 1.125 1.291 1.425
VIO Input offset voltage VREF = 1 V –17 2.57 17 mV
VCMR– Minimum input common mode range 0 V
GATE DRIVER (GDL)
VOH High-level output voltage, GDL ILOAD = –1 mA 6.5 8.2 V
VOL Low-level output voltage, GDL ILOAD = 1 mA 0.152 0.45
IOUT(src) Output source current VGDL= 4 V 2.5 8.1 mA
IOUT(snk) Output sink current VGDL= 4 V 2.5 11.9
THERMAL SHUTDOWN
TSD Thermal shutdown 175 °C
Thermal shutdown hysteresis 10

6.6 Typical Characteristics

Unless otherwise stated, –40°C ≤ TA = TJ ≤ +125°C. All characterization circuits are fully EMI compliant and phase dimmable.
C004_SLUSBW9.png
120VAC 6.8 W Input Top stack = 80 V
Middle stack = 40 V Bottom stack= 20 V VADIM = 1.5 V
Figure 1. System Input Current vs Input Voltage
C005_SLUSBW9.png
120VAC 6.8 W Input Top stack = 80 V
Middle stack = 40 V Bottom stack= 20 V
Figure 3. System Input Current vs ADIM Voltage
C011_SLUSBW9.png
120VAC 6.8 W Input Top stack = 80 V
Middle stack = 40 V Bottom stack= 20 V VADIM = 1.5 V
Figure 5. System Input Current vs TSNS Voltage
C013_SLUSBW9.png
Figure 7. VREF Voltage vs Temperature
C015_SLUSBW9.png
VIN = 100 V GDL Not Operating
Figure 9. VIN Bias Current vs Temperature
C009_SLUSBW9.png
230 VAC 11.2 W Input Top stack = 160 V
Middle stack = 80 V Bottom stack= 40 V VADIM = 1.5 V
Figure 2. System Input Current vs Input Voltage
C010_SLUSBW9.png
230 VAC 11.2 W Input Top stack = 160 V
Middle stack = 80 V Bottom stack= 40 V
Figure 4. System Input Current vs ADIM Voltage
C012_SLUSBW9.png
230 VAC 11. W Input Top stack = 160 V
Middle stack = 80 V Bottom stack= 40 V VADIM = 1.5 V
Figure 6. System Input Current vs TSNS Voltage
C014_SLUSBW9.png
Figure 8. VCC Voltage vs Temperature
C016_SLUSBW9.png
Figure 10. Over-voltage Threshold vs Temperature