ZHCS996D June   2012  – February 2018 TPS81256

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用
      2.      效率与负载电流间的关系
  4. 4 修订历史记录
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operation
      2. 8.3.2 Power-Save Mode
      3. 8.3.3 Current Limit Operation, Maximum Output Current
    4. 8.4 Device Functional Modes
      1. 8.4.1 Softstart, Enable
      2. 8.4.2 Load Disconnect and Reverse Current Protection
      3. 8.4.3 Undervoltage Lockout
      4. 8.4.4 Thermal Regulation
      5. 8.4.5 Thermal Shutdown
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Output Capacitor Selection CEXT
        2. 9.2.2.2 Input Capacitor Selection
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Surface Mount Information
    4. 11.4 Thermal and Reliability Information
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 第三方产品免责声明
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • SIP|9
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from C Revision (February 2016) to D Revision

  • 更新了封装图Go

Changes from B Revision (February 2015) to C Revision

  • 调换了 D & E 尺寸以与“机械数据”制图相匹配；并将说明中的“8 凸点”改为 “9 凸点”。Go
  • Added 社区资源 部分Go

Changes from A Revision (August 2013) to B Revision

  • 添加了器件信息和 ESD 额定值表、特性 说明 部分、器件功能模式、应用和实施部分、系统示例、电源建议部分、器件和文档支持部分以及机械、封装和可订购信息部分。Go
  • Changed the pinout drawing to match the device orientation shown on the MECHANICAL DATA drawing. Go
  • Changed 更改了 SIP 封装“俯视图”图像方向，使“YML LSB”符号和引脚 A1 正确匹配。Go

Changes from * Revision (June 2012) to A Revision

  • Added animated performance characteristics tableGo
  • Deleted MLCC capacitor B1 life documentationGo