To prevent thermal shutdown, TJ must be less than 150°C. The HTSSOP package has good thermal impedance. However, the PCB layout is very important. Good PCB design can optimize heat transfer, which is absolutely essential for the long-term reliability of the device.
- Maximize the copper coverage on the PCB to
increase the thermal conductivity of the board. Maximum copper is extremely
important when there are not any heat sinks attached to the PCB on the other
side of the package.
- Add as many thermal vias as possible directly under the package ground pad to optimize the thermal conductivity of the board.
- All thermal vias should either be plated shut or
plugged and capped on both sides of the board to prevent solder voids. To ensure
reliability and performance, is recommended a solder coverage greater than
85%.