ZHCSHN3D February   2018  – August 2019 TPS7A05

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用电路
      2.      接地电流与输出电流间的关系
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Excellent Transient Response
      2. 7.3.2 Active Discharge
      3. 7.3.3 Low IQ in Dropout
      4. 7.3.4 Undervoltage Lockout (UVLO)
      5. 7.3.5 Enable
      6. 7.3.6 Internal Foldback Current Limit
      7. 7.3.7 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Mode
      2. 7.4.2 Dropout Mode
      3. 7.4.3 Disable Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Recommended Capacitor Types
      2. 8.1.2 Input and Output Capacitor Requirements
      3. 8.1.3 Special Considerations When Ramping Down VIN and Enable
      4. 8.1.4 Load Transient Response
      5. 8.1.5 Dropout Voltage
        1. 8.1.5.1 Behavior When Transitioning From Dropout Into Regulation
        2. 8.1.5.2 Behavior of Output Resulting From Line Transient When in Dropout
      6. 8.1.6 Undervoltage Lockout (UVLO) Operation
      7. 8.1.7 Power Dissipation (PD)
        1. 8.1.7.1 Estimating Junction Temperature
        2. 8.1.7.2 Recommended Area for Continuous Operation
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Design Considerations
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 Spice 模型
      2. 11.1.2 器件命名规则
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

DQN Package
1-mm × 1-mm, 4-Pin X2SON
Top View
DBV Package
5-Pin SOT-23
Top View
DBZ Package
3-Pin SOT-23
Top View
YKA Package
4-Pin DSBGA, 0.35-mm Pitch
Top View
YKA Package
4-Pin DSBGA, 0.35-mm Pitch
Bottom View

Pin Functions

PIN I/O DESCRIPTION
NAME DQN DBV DBZ YKA
IN 4 1 3 A1 Input Input pin. For best transient response and to minimize input impedance, use the recommended value or larger ceramic capacitor from IN to ground as listed in the Recommended Operating Conditions table. Place the input capacitor as close to input of the device as possible.
EN 3 3 — B1 Input Enable pin. Driving this pin to logic high enables the device; driving this pin to logic low disables the device. If enable functionality is not required, this pin must be connected to IN. VEN must not exceed VIN.
GND 2 2 1 B2 — Ground pin. This pin must be connected to ground on the board.
OUT 1 5 2 A2 Output Regulated output pin. A capacitor is required from OUT to ground for stability. For best transient response, use the nominal recommended value or larger ceramic capacitor from OUT to ground. Follow the recommended capacitor value as listed in the Recommended Operating Conditions table. Place the output capacitor as close to output of the device as possible.
NC — 4 — — — No connect pin. This pin is not internally connected. Connect to ground or leave floating.
Thermal pad Pad — — — — Connect the thermal pad to a large-area ground plane. This pad is not an electrical connection to the device ground.