SGLS155B February   2003  – November 2016 TPS768-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Device Operation
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Power-Good Indicator
      2. 8.3.2 Regulator Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown
      2. 8.4.2 Operation With VIN Less Than 2.7 V
      3. 8.4.3 Operation With VIN Greater Than 2.7 V
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Minimum Load Requirements
        2. 9.2.2.2 FB Pin Connection (Adjustable Version Only)
        3. 9.2.2.3 Programming the TPS76801-Q1 Adjustable LDO Regulator
        4. 9.2.2.4 External Capacitor Requirements
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Power Dissipation and Junction Temperature
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

PWP PowerPAD™ Package
20-Pin HTSSOP With Exposed Thermal Pad
Top View
NC – No internal connection

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
EN 5 I Enable input
FB/NC 15 I Feedback input voltage for adjustable device (no connect for fixed options)
GND 3 — LDO ground
GND/HSINK 1, 2, 9, 10, 11, 12, 19, 20 — Ground and heatsink
IN 6, 7 I Input
NC 4, 8, 17, 18 — No connect
OUT 13, 14 O Regulated output voltage
PG 16 O Power-good output
NC 17 — No connect
Thermal pad — — Solder the thermal pad to the board.