ZHCSN50H november   2007  – april 2023 TPS74701

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Other Orderable Devices (non-M3 Suffix)
    6. 6.6  Electrical Characteristics: Orderable Device (M3 Suffix)
    7. 6.7  Typical Characteristics: VEN = VIN (All Other Orderable Devices, Non-M3 Suffix)
    8. 6.8  Typical Characteristics: VEN = VIN = 1.8 V, VOUT = 1.5 V (All Other Orderable Devices, Non-M3 Suffix)
    9. 6.9  Typical Characteristics: IOUT = 50 mA (M3 Suffix)
    10. 6.10 Typical Characteristics: VEN = VIN = 1.8 V, VOUT = 1.5 V (M3 Suffix)
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Programmable Soft-Start
      2. 7.3.2 Enable and Shutdown
      3. 7.3.3 Power Good
      4. 7.3.4 Internal Current Limit
      5. 7.3.5 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Disabled
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input, Output, and Bias Capacitor Requirements
      2. 8.1.2 Transient Response
      3. 8.1.3 Dropout Voltage
      4. 8.1.4 Sequencing Requirements
      5. 8.1.5 Output Noise
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Power Dissipation
        2. 8.4.1.2 Estimating Junction Temperature
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Evaluation Module
        2. 9.1.1.2 Spice Models
      2. 9.1.2 Device Nomenclature
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 静电放电警告
    7. 9.7 术语表
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

说明

TPS74701 低压降 (LDO) 线性稳压器可面向多种应用提供易于使用的稳健型电源管理解决方案。用户可编程软启动通过减少启动时的电容涌入电流,最大限度地减少了输入电源上的应力。软启动具有单调性,旨在为各类处理器和专用集成电路 (ASIC) 供电。借助使能输入和电源正常输出,可通过外部稳压器轻松实现上电排序。凭借全方位的灵活性,该器件可为现场可编程门阵列 (FPGA)、数字信号处理器 (DSP) 等具有特殊启动要求的应用配置可满足其时序要求的解决方案。

该器件还具有高精度的参考电压电路和误差放大器,可在整个负载、线路、温度和过程范围内提供 2% 精度。该器件在使用大于或等于 2.2μF 的任何类型的电容器时都能保持稳定运行,并具有
–40°C 至 +125°C 的额定温度范围。TPS74701 采用小型 3mm × 3mm VSON-10 封装,可与 TPS74801 兼容。

封装信息
器件型号 封装(1) 封装尺寸(标称值)
TPS74701 DRC(VSON,10) 3.00mm × 3.00mm
如需了解所有可用封装,请参阅数据表末尾的可订购产品附录。

 

 

 

GUID-09923153-2C4A-4A98-A7BB-4619881E0483-low.gif典型应用电路(可调节)
GUID-47AA4C15-4A24-477F-ACA8-1F30437FD306-low.gif导通响应