ZHCSFC6 September   2015 TPS65233-1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Boost Converter
      2. 7.3.2 Linear Regulator and Current Limit
      3. 7.3.3 Charge Pump
      4. 7.3.4 Slew Rate Control
      5. 7.3.5 Short Circuit Protection, Hiccup, and Overtemperature Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Tone Generation
      2. 7.4.2 Serial Interface
    5. 7.5 Programming
      1. 7.5.1 I2C Update Sequence
    6. 7.6 Register Map
      1. 7.6.1 Control Register 1 - Address: 0x00H
      2. 7.6.2 Control Register 2 - Address: 0x01H
      3. 7.6.3 Status Register 1 - Address: 0x02H
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Detailed Design Procedure
        1. 8.2.1.1 Capacitor Selection
      2. 8.2.2 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 社区资源
    2. 11.2 商标
    3. 11.3 静电放电警告
    4. 11.4 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range, all voltages are with respect to GND (unless otherwise noted)(1)
MIN MAX UNIT
Voltage VIN, LX, BOOST, VLNB –1 30 V
VCP BOOST + 7
LX –1 30
VCC, EN, FAULT, SCL, SDA, VCTRL, ISEL, EXTM –0.3 7
TCAP –0.3 3.6
PGND, AGND –0.3 0.3
Operating junction temperature, TJ –40 125 °C
Storage temperature, Tstg –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, other pins(1) 2000 V
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, pin 13 (VLNB)(1) 6000
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) 500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN Input operating voltage 4.5 20 V
TA Junction temperature –40 85 °C

6.4 Thermal Information

THERMAL METRIC(1) TPS65233-1 UNIT
RTE (WQFN)
16 PINS
RθJA Junction-to-ambient thermal resistance 43.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 45.6 °C/W
RθJB Junction-to-board thermal resistance 15 °C/W
ψJT Junction-to-top characterization parameter 0.6 °C/W
ψJB Junction-to-board characterization parameter 15 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 3.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

TJ = –40°C to 125°C, VIN = 12 V, fSW = 1 MHz (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
INPUT SUPPLY
VIN Input voltage range VIN 4.5 12 20 V
IDDSDN Shutdown supply current EN = 0 160 µA
IDDQ LDO input quiescent current EN = 1, IOUT = 0 A, VBOOST = 14 V, ILNB = 0 mA 10.5 mA
UVLO VIN under voltage lockout Rising VIN 4.05 4.25 4.45 V
Falling VIN 3.6 3.8 4.1
Hysteresis 450 mV
OUTPUT VOLTAGE
VOUT Regulated output voltage (non-I2C mode) VCTRL = 1, SCL = 0,
IOUT = 500 mA		 18 V
VCTRL = 1, SCL = 1,
IOUT = 500 mA		 18.2 18.6 19
VCTRL = 0, SCL = 0,
IOUT = 500 mA		 13
VCTRL = 0, SCL = 1,
IOUT = 500 mA		 13.1 13.4 13.7
VLINEREG Line regulation-DC VIN = 7.5 V to 16 V,
IOUT = 500 mA		 0.2 %/V
VLOADREG Load regulation-DC IOUT = (10-90%) × IOUTMAX 0.7 %/A
IOCP Output short circuit current limit RSEL = 200 kΩ, TJ = 25°C 580 650 720 mA
Tr, Tf 13-V/18-V transition rising/falling time CTCAP = 5.6 nF 0.33 ms
fSW Boost switching frequency 1040 kHz
Ilimitsw Switching current limit VIN = 12 V, VOUT = 18.6 V 3.2 A
Rdson_LS On resistance of low side FET on CH VIN = 12 V 120 mΩ
Vdrop Linear regulator voltage drop-out IOUT = 500 mA 0.8 V
Irev Reverse bias current EN = 1, VLNB = 21 V 50 mA
Irev_dis Disabled reverse bias current EN = 0, VLNB = 21 V 3 mA
LOGIC SIGNALS
VEN Enable threshold level 1.15 V
VENH Enable threshold level hysteresis 80 mV
VLOGICh, VLOGICl VCTRL, EXTM Logic threshold level High level input voltage 2 V
Low level input voltage 0.8
VOL FAULT FAULT output low voltage FAULT open drain, IOL= 1 mA 0.4 V
fI2C Maximum I2C clock frequency 400 kHz
TONE
ftone Tone frequency 20 22 24 kHz
Atone Tone amplitude IOUT = 0 mA to 500 mA,
COUT = 100 nF		 550 680 750 mV
Dtone Tone duty cycle 45% 50% 55%
PROTECTION
TON Over current protection on time 4 ms
TOFF Over current protection off time 128 ms
THERMAL SHUTDOWN
TTRIP Thermal shut down trip point Rising temperature 160  °C
THYST Thermal shut down hysteresis 20 °C
I2C READ BACK FAULT STATUS
VPGOOD PGOOD trip levels Feedback voltage low side rising 95.3%
Feedback voltage low side falling 94.7%
Feedback voltage high side rising 105.3%
Feedback voltage high side falling 104.7%
Twarn Temperature warning threshold 125 °C
I2C INTERFACE
VIH SDA,SCL input high voltage 2 V
VIL SDA,SCL input low voltage 0.8 V
II Input current SDA, SCL, VI = 0.4 V to 4.5 V –10 10 µA
VOL SDA output low voltage SDA open drain, IOL = 2 mA 0.4 V
f(SCL) Maximum SCL clock frequency 400 kHz
CB Capacitance of one bus line (SCL and SDA) 400 pF

6.6 I2C Interface Timing Requirements

MIN MAX UNIT
tBUF Bus free time between a STOP and START condition 1.3 µs
tHD, STA Hold time (Repeated) START condition 0.6 µs
tSU, STO Setup time for STOP condition 0.6 µs
tLOW LOW period of the SCL clock 1.3 µs
tHIGH HIGH period of the SCL clock 0.6 µs
tSU, STA Setup time for a repeated START condition 0.6 µs
tSU, DAT Data setup time 0.1 µs
tHD, DAT Data hold time 0 0.9 µs
tRCL Rise time of SCL signal 20 + 0.1CB 300 ns
tRCL1 Rise time of SCL signal after a repeated START condition and after an acknowledge BIT 20 + 0.1CB 300 ns
tf Fall time of SCL signal 20 + 0.1CB 300 ns
tr Rise time of SDA signal 20 + 0.1CB 300 ns
tFDA Fall time of SDA signal 20 + 0.1CB 300 ns

6.7 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
OUTPUT VOLTAGE
Tr, Tf 13-V/18-V Transition rising falling time Ccap = 5.6 nF 0.33 ms
TONE
Trtone Tone rise time IOUT = 0 to 500 mA, COUT = 100 nF 10 µs
Tftone Tone fall time IOUT = 0 to 500 mA, COUT = 100 nF 10 µs
TPS65233-1 fig053_I2C_int_tim_dia_SLVSC22.gif Figure 1. I2C Interface Timing Diagram

6.8 Typical Characteristics

TA = 25°C, VIN = 12 V, fSW = 1 MHz, L = 4.7 µH, CBoost = 2 × 22 µF/35 V (unless otherwise noted)
TPS65233-1 D001_SLVSD66.gif
Figure 2. Power Efficiency
TPS65233-1 D003_SLVSD66.gif
Figure 4. Load Regulation, VLNB = 13.4 V
TPS65233-1 D005_SLVSD66.gif
Figure 6. Shutdown Current and Junction Temperature
TPS65233-1 D002_SLVSD66.gif
Figure 3. Load Regulation, VLNB = 18.6 V
TPS65233-1 D004_SLVSD66.gif
Figure 5. LDO Input Quiescent Current and Junction Temperature, VBOOST = 14 V, ILNB = 0 mA
TPS65233-1 D006_SLVSD66.gif
Figure 7. LNB Current Limit and Junction Temperature
(ILIM = 650 mA)