ZHCSID4B June   2018  – January 2021 TPS61372

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout
      2. 7.3.2 Enable and Disable
      3. 7.3.3 Error Amplifier
      4. 7.3.4 Bootstrap Voltage (BST)
      5. 7.3.5 Load Disconnect
      6. 7.3.6 Overvoltage Protection
      7. 7.3.7 Thermal Shutdown
      8. 7.3.8 Start-Up
      9. 7.3.9 Short Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation
      2. 7.4.2 Auto PFM Mode
      3. 7.4.3 Forced PWM Mode
      4. 7.4.4 Mode Selectable
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Setting the Output Voltage
        3. 8.2.2.3 Selecting the Inductor
        4. 8.2.2.4 Selecting the Output Capacitors
        5. 8.2.2.5 Selecting the Input Capacitors
        6. 8.2.2.6 Loop Stability and Compensation
          1. 8.2.2.6.1 Small Signal Model
        7. 8.2.2.7 Loop Compensation Design Steps
        8. 8.2.2.8 Selecting the Bootstrap Capacitor
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
      1. 10.2.1 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方产品免责声明
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • YKB|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1)TPS61372UNIT
YKB
16 PINS
RθJAJunction-to-ambient thermal resistance87.1°C/W
RθJC(top)Junction-to-case (top) thermal resistance0.7°C/W
RθJBJunction-to-board thermal resistance24.1°C/W
ψJTJunction-to-top characterization parameter0.4°C/W
ψJBJunction-to-board characterization parameter24.3°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.