ZHCSD74A January   2014  – December 2014 TPS61097A-33

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Controller Circuit
      2. 8.3.2 Device Enable and Shutdown Mode
      3. 8.3.3 Bypass Switch
      4. 8.3.4 Startup
      5. 8.3.5 Operation at Output Overload
      6. 8.3.6 Undervoltage Lockout
      7. 8.3.7 Overtemperature Protection
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Adjustable Bypass Switching
      2. 9.1.2 Managing Inrush Current
      3. 9.1.3 Thermal Considerations
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection
        2. 9.2.2.2 Capacitor Selection
          1. 9.2.2.2.1 Input Capacitor
          2. 9.2.2.2.2 Output Capacitor
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 第三方产品免责声明
    2. 12.2 商标
    3. 12.3 静电放电警告
    4. 12.4 术语表
  13. 13机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VI Input voltage range VIN –0.3 7 V
L –0.3 7
VOUT –0.3 7
EN –0.3 7
IMAX Maximum continuous output current 400 mA
TJ Junction temperature range –40 150 °C
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN MAX UNIT
VIN Input voltage range 0.9 5.5 V
VEN Enable voltage range 0 5.5 V
TA Operating free air temperature range –40 85 °C
TJ Operating junction temperature range –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) TPS61097A-33 UNIT
DBV
5 PINS
θJA Junction-to-ambient thermal resistance 208.7 °C/W
θJCtop Junction-to-case (top) thermal resistance 124.5
θJB Junction-to-board thermal resistance 36.9
ψJT Junction-to-top characterization parameter 14.7
ψJB Junction-to-board characterization parameter 36
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

Over recommended free-air temperature range and over recommended input voltage range (typical at an ambient temperature range of 25°C) (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DC/DC STAGE
VIN Input voltage 0.9 5.5 V
VOUT Output voltage VIN = 1.2 V , IOUT = 10 mA 3.20 3.30 3.40
ISW Switch current limit VOUT = 3.3 V 200 400 475 mA
Rectifying switch on resistance VOUT = 3.3 V 1.0 Ω
Main switch on resistance VOUT = 3.3 V 1.0
Bypass switch on resistance VIN = 1.2 IOUT = 100 mA 3.4
Line regulation VIN < VOUT, VIN = 1.2 V to 1.8 V, IOUT = 10 mA 0.5%
Load regulation VIN < VOUT, IOUT = 10 mA to 50 mA, VIN = 1.8 V 0.5%
IQ Quiescent current VIN IOUT = 0 mA, VEN = VIN = 1.2 V, VOUT = 3.5 V 2 4 μA
VOUT 5 8
ISD Shutdown current VIN VEN = 0 V, VIN = 1.2 V, IOUT = 0 mA 0.005 0.15 μA
VEN = 0 V, VIN = 3 V, IOUT = 0 mA 0.005 0.15
Leakage current into L VEN = 0 V, VIN = 1.2 V, VL = 1.2 V 0.01 1
CONTROL STAGE
EN input current EN = 0 V or EN = VIN 0.01 0.1 μA
VIL Logic low level, EN falling edge 0.58 V
VIH Logic high level, EN rising edge 0.78 VIN + 1.0 V
OTP Overtemperature protection 150 °C
OTPHYST Overtemperature hysteresis 20
VUVLO Undervoltage lock-out threshold for turn off VIN decreasing 0.6 0.8 V

6.6 Typical Characteristics

Refer to Figure 19 for reference designators.

C001_SLVSCF2.pngFigure 1. Maximum Output Current vs Input Voltage
C003_SLVSCF2.pngFigure 3. Efficiency vs Input Voltage
C005_SLVSCF2.pngFigure 5. Input Current vs Input Voltage
C007_SLVSCF2.pngFigure 7. VIH vs Output Current
C009_SLVSCF2.pngFigure 9. Output Voltage vs Input Voltage
GR_014 Load Transient Response.pngFigure 11. Load Transient Response
GR_016 Switching Waveform Continuous.pngFigure 13. Switching Waveform, Continuous Mode
C002_SLVSCF2.pngFigure 2. Efficiency vs Output current
C004_SLVSCF2.pngFigure 4. Input Current vs Input Voltage
C006_SLVSCF2.pngFigure 6. VIH vs Temperature
C008_SLVSCF2.pngFigure 8. Output Voltage vs Output Current
GR_013 Output Voltage Ripple.png
Figure 10. Output Voltage Ripple
GR_015.gifFigure 12. Line Transient Response
GR_017 Switching Waveform Discontinuous.pngFigure 14. Switching Waveform, Discontinuous Mode