ZHCSP82A december   2022  – may 2023 TPS562242

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PWM Operation and D-CAP3™ Control Mode
      2. 7.3.2 Eco-mode Control
      3. 7.3.3 Soft Start and Prebiased Soft Start
      4. 7.3.4 Overvoltage Protection
      5. 7.3.5 Large Duty Operation
      6. 7.3.6 Current Protection and Undervoltage Protection
      7. 7.3.7 Undervoltage Lockout (UVLO) Protection
      8. 7.3.8 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Eco-mode Operation
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design with WEBENCH® Tools
        2. 8.2.2.2 Output Voltage Resistors Selection
        3. 8.2.2.3 Output Filter Selection
        4. 8.2.2.4 Input Capacitor Selection
        5. 8.2.2.5 Bootstrap Capacitor Selection
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Custom Design with WEBENCH® Tools
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) DRL (SOT-563) UNIT
6 PINS
RθJA(2) Junction-to-ambient thermal resistance 137.4 °C/W
RθJA_effective(3) Junction-to-ambient thermal resistance on EVM board 74 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 58.8 °C/W
RθJB Junction-to-board thermal resistance 29.8 °C/W
ψJT Junction-to-top characterization parameter 1.3 °C/W
ψJB Junction-to-board characterization parameter 29.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) The value of RθJA given in this table is only valid for comparison with other packages and can not be used for design purposes. These values were simulated on a standard JEDEC board. These values do not represent the performance obtained in an actual application.
(3) This RθJA_effective is tested on TPS562242EVM board (2 layer, copper thickness is 2-oz) at VIN = 12 V, VOUT =5 V, IOUT = 2A, TA = 25°C.