ZHCSQS0E August   2006  – January 2024 TPS5410

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information 
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Oscillator Frequency
      2. 6.3.2  Voltage Reference
      3. 6.3.3  Enable (ENA) and Internal Slow-Start
      4. 6.3.4  Undervoltage Lockout (UVLO)
      5. 6.3.5  Boost Capacitor (BOOT)
      6. 6.3.6  Output Feedback (VSENSE)
      7. 6.3.7  Internal Compensation
      8. 6.3.8  Voltage Feed-Forward
      9. 6.3.9  Pulse-Width-Modulation (PWM) Control
      10. 6.3.10 Overcurrent Limiting
      11. 6.3.11 Overvoltage Protection
      12. 6.3.12 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Minimum Input Voltage
      2. 6.4.2 ENA Control
  8. 7 Applications and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Application Circuit
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Switching Frequency
          2. 7.2.1.2.2 Input Capacitors
          3. 7.2.1.2.3 Output Filter Components
            1. 7.2.1.2.3.1 Inductor Selection
            2. 7.2.1.2.3.2 Capacitor Selection
          4. 7.2.1.2.4 Output Voltage Setpoint
          5. 7.2.1.2.5 Boot Capacitor
          6. 7.2.1.2.6 Catch Diode
          7. 7.2.1.2.7 Advanced Information
            1. 7.2.1.2.7.1 Output Voltage Limitations
            2. 7.2.1.2.7.2 Internal Compensation Network
            3. 7.2.1.2.7.3 Thermal Calculations
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Using All Ceramic Capacitors
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
          1. 7.2.2.2.1 Output Filter Capacitor Selection
          2. 7.2.2.2.2 External Compensation Network
        3. 7.2.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Pin Configuration and Functions

GUID-62C0F50F-7BE1-446D-9996-733A19B7A8CD-low.gif Figure 4-1 D Package,8 Pin SOICTop View
Table 4-1 Pin Functions
PIN I/O DESCRIPTION
NAME NO.
BOOT 1 O Boost capacitor for the high-side FET gate driver. Connect 0.01 μF low ESR capacitor from BOOT pin to PH pin.
NC 2, 3 — Not connected internally.
VSENSE 4 I Feedback voltage for the regulator. Connect to output voltage divider.
ENA 5 I On and off control. Below 0.5 V, the device stops switching. Float the pin to enable.
GND 6 — Ground.
VIN 7 I Input supply voltage. Bypass VIN pin to GND pin close to device package with a high quality, low ESR ceramic capacitor.
PH 8 O Source of the high side power MOSFET. Connected to external inductor and diode.