ZHCSQF1 June   2022 TPS51633

PRODUCTION DATA  

  1. 1特性
  2. 2应用
  3. 3说明
  4. 4Revision History
  5. 5Device and Documentation Support
    1. 5.1 接收文档更新通知
    2. 5.2 支持资源
    3. 5.3 Trademarks
    4. 5.4 Electrostatic Discharge Caution
    5. 5.5 术语表
  6. 6Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.3 Trademarks

D-CAP+, PowerPAD™, and TI E2E™ are trademarks of Texas Instruments.

Intel® is a registered trademark of Intel.

All trademarks are the property of their respective owners.