ZHCSHX8D September   2017  – October 2019 TPS50601A-SP

PRODUCTION DATA.  

  1. 特性
    1.     VIN = PVIN = 5V 条件下的效率
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  VIN and Power VIN Pins (VIN and PVIN)
      2. 7.3.2  Voltage Reference
      3. 7.3.3  Adjusting the Output Voltage
      4. 7.3.4  Safe Start-Up Into Prebiased Outputs
      5. 7.3.5  Error Amplifier
      6. 7.3.6  Slope Compensation
      7. 7.3.7  Enable and Adjust UVLO
      8. 7.3.8  Adjustable Switching Frequency and Synchronization (SYNC)
      9. 7.3.9  Slow Start (SS/TR)
      10. 7.3.10 Power Good (PWRGD)
      11. 7.3.11 Sequencing (SS/TR)
      12. 7.3.12 Output Overvoltage Protection (OVP)
      13. 7.3.13 Overcurrent Protection
        1. 7.3.13.1 High-Side MOSFET Overcurrent Protection
        2. 7.3.13.2 Low-Side MOSFET Overcurrent Protection
      14. 7.3.14 Thermal Shutdown
      15. 7.3.15 Turn-On Behavior
      16. 7.3.16 Small Signal Model for Frequency Compensation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Fixed-Frequency PWM Control
      2. 7.4.2 Continuous Current Mode (CCM) Operation
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Operating Frequency
        2. 8.2.2.2 Output Inductor Selection
        3. 8.2.2.3 Output Capacitor Selection
        4. 8.2.2.4 Slow Start Capacitor Selection
        5. 8.2.2.5 Undervoltage Lockout (UVLO) Set Point
        6. 8.2.2.6 Output Voltage Feedback Resistor Selection
        7. 8.2.2.7 Compensation Component Selection
      3. 8.2.3 Parallel Operation
      4. 8.2.4 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Layout Guidelines

Layout is a critical portion of good power supply design. Standard good practices should be applied. Some basic guidelines follow:

  • The top layer contains the main power traces for PVIN, VIN, VOUT, and PHASE. Also on the top layer are connections for the remaining pins of the TPS50601A-SP and a large top side area filled with ground.
  • The top layer ground area should be connected to the internal ground layer(s) using vias at the input bypass capacitor and the output filter capacitor.
  • Thermal pad can be electrically floating or connected externally. If electrically connected externally then it must be connected to GND. Customer should evaluate their system performance when thermal pad is electrically isolated and thermally conductive.
  • Preferred approach is that GND pin should be tied directly to the power pad under the IC and the PGND.
  • The PVIN and VIN pins should be bypassed to ground with ceramic capacitors placed as close as possible to the pins.
  • Since the PH connection is the switching node, the output inductor should be located close to the PH pins, and the area of the PCB conductor minimized to prevent excessive capacitive coupling.
  • The RT, REFCAP and COMP pins are sensitive to noise so the respective components should be located as close as possible to the IC and routed with minimal lengths of trace.
  • The feedback voltage signal VSENSE should be routed away from the switching node.