ZHCS840G February   2012  – February 2019 TPS3700

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      简化原理图
      2.      输出与输入阈值和迟滞
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Inputs (INA+, INB–)
      2. 7.3.2 Outputs (OUTA, OUTB)
      3. 7.3.3 Window Voltage Detector
      4. 7.3.4 Immunity to Input Terminal Voltage Transients
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation (VDD > UVLO)
      2. 7.4.2 Undervoltage Lockout (V(POR) < VDD < UVLO)
      3. 7.4.3 Power-On Reset (VDD < V(POR))
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 VPULLUP to a Voltage Other Than VDD
      2. 8.1.2 Monitoring VDD
      3. 8.1.3 Monitoring a Voltage Other Than VDD
      4. 8.1.4 Monitoring Overvoltage and Undervoltage for Separate Rails
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Resistor Divider Selection
        2. 8.2.2.2 Pullup Resistor Selection
        3. 8.2.2.3 Input Supply Capacitor
        4. 8.2.2.4 Input Capacitors
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
  9. Power-Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
        1. 11.1.1.1 评估模块
      2. 11.1.2 器件命名规则
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 术语表
  12. 12机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DSE|6
  • DDC|6
散热焊盘机械数据 (封装 | 引脚)
订购信息

Layout Guidelines

Placing a 0.1-µF capacitor close to the VDD terminal to reduce the input impedance to the device is good analog design practice. The pullup resistors can be separated if separate logic functions are needed (as shown in Figure 23) or both resistors can be tied to a single pullup resistor if a logical AND function is desired.