ZHCSM06C december   2020  – may 2023 TPS272C45

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
    1. 6.1 Recommended Connections for Unused Pins
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 SNS Timing Characteristics
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Programmable Current Limit
        1. 9.3.1.1 Inrush Current Handling
        2. 9.3.1.2 Calculating RILIMx
        3. 9.3.1.3 Configuring ILIMx From an MCU
      2. 9.3.2 Low Power Dissipation
      3. 9.3.3 Protection Mechanisms
        1. 9.3.3.1 Short-Circuit Protection
          1. 9.3.3.1.1 VS During Short-to-Ground
        2. 9.3.3.2 Inductive Load Demagnetization
        3. 9.3.3.3 Thermal Shutdown
        4. 9.3.3.4 Undervoltage Lockout on VS (UVLO)
        5. 9.3.3.5 Undervoltage Lockout on Low Voltage Supply (VDD_UVLO)
        6. 9.3.3.6 Power-Up and Power-Down Behavior
        7. 9.3.3.7 Overvoltage Protection (OVPR)
      4. 9.3.4 Diagnostic Mechanisms
        1. 9.3.4.1 Current Sense
          1. 9.3.4.1.1 RSNS Value
            1. 9.3.4.1.1.1 Current Sense Output Filter
        2. 9.3.4.2 Fault Indication
          1. 9.3.4.2.1 Fault Event Diagrams
        3. 9.3.4.3 Short-to-Supply or Open-Load Detection
          1. 9.3.4.3.1 Detection With Switch Enabled
          2. 9.3.4.3.2 Detection With Switch Disabled
        4. 9.3.4.4 Current Sense Resistor Sharing
    4. 9.4 Device Functional Modes
      1. 9.4.1 Off
      2. 9.4.2 Diagnostic
      3. 9.4.3 Active
      4. 9.4.4 Fault
  11. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 IEC 61000-4-5 Surge
      2. 10.1.2 Inverse Current
      3. 10.1.3 Loss of GND
      4. 10.1.4 Paralleling Channels
      5. 10.1.5 Thermal Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 RILIM Calculation
        2. 10.2.2.2 Diagnostics
          1. 10.2.2.2.1 Selecting the RISNS Value
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Pin Configuration and Functions

GUID-20220211-SS0I-2BB0-4NLD-LNBNGMHLLR60-low.svgFigure 6-1 RHF Package, 24-Pin QFN (Top View) Version A and C
GUID-20220211-SS0I-KSSB-WMN6-6NGZMWM90B9H-low.svgFigure 6-3 RHF Package, 24-Pin QFN (Top View) Version D
GUID-20220211-SS0I-SFGF-LC90-VNLFGDJ2DMJX-low.svgFigure 6-2 RHF Package, 24-Pin QFN (Top View) Version B
Table 6-1 Pin Functions
PINI/ODESCRIPTION
NAMETPS272C45A, TPS272C45CTPS272C45BTPS272C45D
DIA_EN12

12

12

IEnables diagnostic functionality
SEL13

13

13

ISEL = 0: SNS pin measures channel 1 load current or fault output SEL = 1: SNS pin measures channel 2 load current or fault output.
LATCH14

14

14

ISets retry behavior. LATCH = 0: auto-retry after faults or LATCH = 1: latch off after faults.
EN215

15

15

IEnables channel 2 output current
EN116

16

16

IEnables channel 1 output current
GND17

17, 19

17

GNDDevice ground
ILIMD18

18

—

OConnect RILIMD to GND to set higher inrush current limit time duration.
FLT2

—

—

18

OOpen drain output with pulldown to signal fault on Ch2 (active low signal).
ILIM220

20

20

OConnect RILIM2 to GND to set channel 2 current limit.
ILIM121

21

21

OConnect RILIM1 to GND to set channel 1 current limit.
PowerPadPad

Pad

Pad

—Heat dissipation pad – connect to device GND. Maximize PCB copper area for the best heat dissipation.
VS23, 24, 8, 923, 24, 8, 923, 24, 8, 9IPrimary input supply, connect through vias down to a power plane to connect the two set of VS power pins.
VOUT11, 2, 31, 2, 31, 2, 3OChannel 1 output
NC4, 224, 224, 22No connect pin, leave unconnected
VOUT25, 6, 75, 6, 75, 6, 7OChannel 2 output
FLT1010

—

OOpen drain output with pulldown to signal fault on either channel (active low signal).
FLT1

—

—

10

OOpen drain output with pulldown to signal fault on Ch1 (active low signal).
SNS111111OAnalog current output corresponding to load current – connect a resistor to GND to convert to voltage.
VDD19—19IVersion A: Connect low voltage supply input for lower

power dissipation(1).

Version C, D: Optionally tie to gnd to use internal LDO or connect to external low voltage supply(1).

(1) When the device is configured to support an external regulator connected to VDD, it is required that the supply input for the external regulator is derived from the same VS supply of TPS272C45 as shown in Figure 9-6.