ZHCSM06C december   2020  – may 2023 TPS272C45

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
    1. 6.1 Recommended Connections for Unused Pins
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 SNS Timing Characteristics
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Programmable Current Limit
        1. 9.3.1.1 Inrush Current Handling
        2. 9.3.1.2 Calculating RILIMx
        3. 9.3.1.3 Configuring ILIMx From an MCU
      2. 9.3.2 Low Power Dissipation
      3. 9.3.3 Protection Mechanisms
        1. 9.3.3.1 Short-Circuit Protection
          1. 9.3.3.1.1 VS During Short-to-Ground
        2. 9.3.3.2 Inductive Load Demagnetization
        3. 9.3.3.3 Thermal Shutdown
        4. 9.3.3.4 Undervoltage Lockout on VS (UVLO)
        5. 9.3.3.5 Undervoltage Lockout on Low Voltage Supply (VDD_UVLO)
        6. 9.3.3.6 Power-Up and Power-Down Behavior
        7. 9.3.3.7 Overvoltage Protection (OVPR)
      4. 9.3.4 Diagnostic Mechanisms
        1. 9.3.4.1 Current Sense
          1. 9.3.4.1.1 RSNS Value
            1. 9.3.4.1.1.1 Current Sense Output Filter
        2. 9.3.4.2 Fault Indication
          1. 9.3.4.2.1 Fault Event Diagrams
        3. 9.3.4.3 Short-to-Supply or Open-Load Detection
          1. 9.3.4.3.1 Detection With Switch Enabled
          2. 9.3.4.3.2 Detection With Switch Disabled
        4. 9.3.4.4 Current Sense Resistor Sharing
    4. 9.4 Device Functional Modes
      1. 9.4.1 Off
      2. 9.4.2 Diagnostic
      3. 9.4.3 Active
      4. 9.4.4 Fault
  11. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 IEC 61000-4-5 Surge
      2. 10.1.2 Inverse Current
      3. 10.1.3 Loss of GND
      4. 10.1.4 Paralleling Channels
      5. 10.1.5 Thermal Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 RILIM Calculation
        2. 10.2.2.2 Diagnostics
          1. 10.2.2.2.1 Selecting the RISNS Value
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

3 说明

TPS272C45 是一款旨在满足工业控制系统要求的双通道智能高侧开关。低导通电阻（RDS(on) 为 45mΩ）可最大限度地降低器件功耗，实现 100mA 至 3A 的宽输出负载电流范围。该器件提供一个额外的低压电源（3.3V 至 5V）输入引脚，从而最大限度地降低空载功耗。该器件集成了多种保护功能，如热关断、输出钳位和过流限制。这些功能可在发生故障（如短路）时提高系统的稳健性。

TPS272C45 器件采用可调阈值电流限制电路，通过减小驱动大容性负载时的浪涌电流并尽可能降低过载电流，提高了系统的可靠性。该器件还可配置浪涌电流持续时间，可通过较高的电流驱动高浪涌电流负载（如灯）或快速为容性负载充电。该器件还可提供精确的负载电流检测，以提高负载诊断功能，从而更好地进行预测性维护。

TPS272C45 器件采用引脚间距为 0.5mm 的 24 引脚 5mm × 4mm 小型 QFN 无引线封装，从而最大限度地减小 PCB 尺寸。

封装信息
器件型号封装(1)封装尺寸（标称值）
TPS272C45QFN (24)5.00mm × 4.00mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附录。
GUID-20220211-SS0I-GVW6-T8GH-XNFT1BQCHV7Z-low.svg典型应用