ZHCSD51 December   2014 TPS2592BA , TPS2592BL

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 应用电路原理图
  5. 5 修订历史记录
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 GND
      2. 9.3.2 VIN
      3. 9.3.3 dV/dT
      4. 9.3.4 BFET
      5. 9.3.5 EN/UVLO
      6. 9.3.6 ILIM
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Simple 3.7-A eFuse Protection for Set Top Boxes
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Step by Step Design Procedure
          2. 10.2.1.2.2 Programming the Current-Limit Threshold: RILIM Selection
          3. 10.2.1.2.3 Undervoltage Lockout Set Point
          4. 10.2.1.2.4 Setting Output Voltage Ramp Time (TdVdT)
            1. 10.2.1.2.4.1 Case 1: Start-up without Load: Only Output Capacitance COUT Draws Current During Start-up
            2. 10.2.1.2.4.2 Case 2: Start-up with Load: Output Capacitance COUT and Load Draws Current During Start-up
        3. 10.2.1.3 Support Component Selection - CVIN
        4. 10.2.1.4 Application Curves
      2. 10.2.2 Inrush and Reverse Current Protection for Hold-Up Capacitor Application (e.g., SSD)
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
          1. 10.2.2.2.1 Programming the Current-Limit Threshold: RILIM Selection
          2. 10.2.2.2.2 Undervoltage Lockout Set Point
          3. 10.2.2.2.3 Setting Output Voltage Ramp Time (TdVdT)
        3. 10.2.2.3 Support Component Selection - CVIN
        4. 10.2.2.4 Application Curves
    3. 10.3 Maximum Device Power Dissipation Considerations
  11. 11Power Supply Recommendations
    1. 11.1 Transient Protection
    2. 11.2 Output Short-Circuit Measurements
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 器件支持
      1. 13.1.1 第三方产品免责声明
    2. 13.2 相关链接
    3. 13.3 商标
    4. 13.4 静电放电警告
    5. 13.5 术语表
  14. 14机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 修订历史记录

日期 修订版本 注释
2014年12月 * 最初发布版本