ZHCS486A October   2011  – June 2015 TPS22933

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Parametric Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 ON and OFF Control
      2. 8.3.2 Power Changeover
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 LDO Capacitor (for CAP Pin)
      2. 9.1.2 Using the CAP Pin as a Power Output
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 社区资源
    2. 12.2 商标
    3. 12.3 静电放电警告
    4. 12.4 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VIN Input voltage BAT, USB, DC_IN –0.3 14 V
VOUTPUT Output voltage VOUT, LOUT –0.3 6 V
VEN Input voltage EN –0.3 6 V
IMAX Maximum continuous switch current 75 mA
IPLS Maximum pulsed switch current, pulse <300 µs, 2% duty cycle 100 mA
TA Operating free-air temperature –40 85 °C
Tlead Maximum lead temperature (10-s soldering time) 300 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. Pins listed as ±1000 V may actually have higher performance.

6.3 Recommended Operating Conditions

MIN NOM MAX UNIT
VIN Input voltage BAT, USB, DC_IN 2.5 12 V
VEN EN 0 5.5 V
VIH EN pin High-level input voltage,
(EN > VIH Min, VOUT = LDO Output)		 BAT = 2.5 V to 5.5 V, USB, DC_IN = 2.5 V to 12 V 1.15 5.5 V
VIL EN pin Low-level input voltage,
(EN< VIL Max, VOUT = pulldown)		 BAT = 2.5 V to 5.5 V, USB, DC_IN = 2.5 V to 12 V 0 0.6 V
IOUT-LOUT LOUT Current VBAT = 4.2 V OR VUSB = 5 V OR VDC_IN = 5 V,
EN = 3.4 V, IOUT-VOUT = 0 mA		 50 mA
IOUT-VOUT VOUT Current VBAT = 4.2 V OR VUSB = 5 V OR VDC_IN = 5 V,
EN = 3.4 V, IOUT-LOUT = 0 mA		 50 mA
IOUT-TOTAL LOUT + VOUT current VBAT = 4.2 V OR VUSB = 5 V OR VDC_IN = 5 V,
EN = 3.4 V		 50 mA
CAP LDO Capacitor (on CAP pin) 20(1) nF
LOUT Capacitor 1 µF
VOUT Capacitor 1 µF

6.4 Thermal Information

THERMAL METRIC(1) TPS22933 UNIT
RSE (UQFN)
6 PINS
RθJA Junction-to-ambient thermal resistance 115.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 59.9 °C/W
RθJB Junction-to-board thermal resistance 27.4 °C/W
ψJT Junction-to-top characterization parameter 2.1 °C/W
ψJB Junction-to-board characterization parameter 27.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

BAT = 2.5 V to 12.0 V, USB = 2.5 V to 12.0 V, DC_IN = 2.5 V to 12.0 V, TA = –40ºC to +85ºC (unless otherwise noted)
PARAMETER TEST CONDITIONS(2) (3) (6) TA MIN TYP(1) MAX UNIT
IIN-BAT Operating current IOUT = 0 mA, VBAT = 4.2 V, VUSB = 3 V, VDC_IN = 3 V, EN = 3.4 V Full 9.2 15 µA
Quiescent current IOUT = 0, VBAT = 4.2 V, VUSB = 5 V, VDC_IN = 3 V, EN = 3.4 V 0.7 2
IIN-USB Operating current IOUT = 0 mA, VBAT = 4.2 V, VUSB = 5 V, VDC_IN = 3 V, EN = 3.4 V Full 9.2 15 µA
Quiescent current IOUT = 0, VBAT = 4.2V, VUSB = 5V, VDC_IN = 5.5V, EN = 3.4 V 0.7 2
IIN-DC_IN Operating current IOUT = 0 mA, VBAT = 4.2 V, VUSB = 3 V, VDC_IN = 5 V, EN = 3.4 V Full 9.2 15 µA
Quiescent current IOUT = 0, VBAT = 4.2V, VUSB = 5.5V, VDC_IN = 5V, EN = 3.4 V 0.7 2
IIN-USB Hi-Voltage operating current IOUT = 0 mA, VBAT = 4.2 V, VUSB = 12 V, VDC_IN = 5 V, EN = 3.4 V Full 10.8 20 µA
IIN-DC_IN Hi-Voltage operating current IOUT = 0 mA, VBAT = 4.2 V, VUSB = 5 V, VDC_IN = 12 V, EN = 3.4 V Full 10.8 20 µA
RON ON resistance (USB to CAP, BAT to CAP, DC_IN to CAP) VIN = 5.0 V, IOUT = 10 mA 25ºC 2.4 3.3 Ω
Full 3.5
VIN = 4.2 V, IOUT = 10 mA 25ºC 2.6 3.5 Ω
Full 4
VIN = 2.5 V, IOUT = 10 mA 25ºC 3.8 5 Ω
Full 6
RONVOUT ON resistance (LDO output to VOUT) VIN = 4.2 V, IOUT-VOUT = 10 mA 25ºC 1.3 2.5 Ω
Full 3
RPD Output pulldown resistance VIN = 4.2 V, VEN = 0 V, I(into VOUT) = 10 mA 25ºC 63.8 120 Ω
IEN EN input leakage VEN = 1.6 V to 5.5 V or GND Full 1 µA
VDO-VOUT Dropout voltage VOUT (4) (5) IOUT = 10 mA Full 0.11 V
VDO-LOUT Dropout voltage LOUT IOUT = 10 mA(4) (5) Full 0.1 V
VLOUT Always on LDO output voltage (LOUT pin) VIN < 3.4 V, IOUT = 10 mA, VEN = 1.8 V Full VIN – VDO-LOUT V
VIN > 4 V, IOUT = 10 mA, VEN = 1.8 V Full 3.42 3.6 3.78
VVOUT Switched LDO output voltage (VOUT pin) VIN < 3.4 V, IOUT = 10 m A, VEN = 1.8 V Full VIN – VDO-VOUT V
VIN > 4 V, IOUT = 10 mA, VEN = 1.8 V Full 3.39 3.57 3.75
VCO Changeover voltage VBAT = 4.2 V, VUSB = 4.0 V rising to 4.4 V Full 0.15 V
tCO Changeover time VBAT=4.2 V, VUSB = 4.0 V rising to 4.4 V, CAP = 0.01 µF, IOUT = 10 mA 25ºC 18 µs
Full 50
tOFF VOUT OFF-time EN high to low, C(VOUT) = 1 µF, VOUT load = 360 Ω Full 32 µs
tON VOUT ON-time EN low to high, C(VOUT) = open, VOUT load = 360 Ω Full 65 µs
(1) TYP is 25ºC, BAT = 4.2-V, USB = 0-V, DC_IN = 0-V.
(2) VIN is defined as the highest voltage present on the BAT, USB and DC_IN pins.
(3) One of the voltages on BAT, USB and DC_IN must be > VIN (Min), others can be 0 V.
(4) Dropout voltage is the minimum input to output voltage differential needed to maintain regulation at a specified output current. In dropout, the output voltage is equal to: VIN – VDROPOUT.
(5) Dropout voltage is measured at the VIN that causes the output to drop to 100mV below its nominal voltage. For VOUT, the voltage drop across the output switch is included (10mA × RONVOUT).
(6) VBAT, VUSB and VDC_IN refer to the voltages on BAT, USB and DC_IN respectively. OUT, IOUT-VOUT and IOUT-LOUT refer to the currents for the combined output current for VOUT and LOUT, the current on VOUT and the current on LOUT respectively.

6.6 Typical Characteristics

Table 1. Performance Graphs and Plots

Type Description Figure
Graph RON versus VIN (BAT, USB, DC_IN) 25°C Figure 1
Graph RON versus VIN (Any input) Figure 2
Graph Quiescent Current versus Input Voltage (Any input) Figure 3
Graph Operating Current versus Input Voltage (Any Input) Figure 4
Scope Plot tOFF (VIN = 4.2 V, C(VOUT) = 1 uF, 25°C) Figure 5
Scope Plot tOFF (VIN = 4.2 V, C(VOUT) = open, 25°C) Figure 6
Scope Plot tON (VIN = 4.2 V, C(VOUT) = 1 uF, 25°C) Figure 7
Scope Plot tON (VIN = 4.2 V, C(VOUT) = open, 25°C) Figure 8
Graph LOUT and VOUT versus Temperature at VIN = 4.2 V Figure 9
Graph LOUT and VOUT versus IOUT (VIN = 4.2 V, Temp = 25°C) Figure 10
Graph LOUT Dropout Voltage versus Temperature (VIN = 2.5 V) Figure 11
Graph VOUT Dropout Voltage versus Temperature (VIN = 2.5 V) Figure 12
Graph Output Pulldown Resistance (RPD) versus Temperature (10 mA into VOUT) Figure 13
TPS22933 C013_lvsb34.png
Figure 1. RPD vs Temperature
TPS22933 C003_lvsb34.png
Figure 3. RON vs VIN
TPS22933 C002_lvsb34.png
Figure 5. IIN (Operating) vs VIN
TPS22933 C005_lvsb34.png
Figure 7. VOUT tOFF (No Capacitor on VOUT)
TPS22933 C007_lvsb34.png
Figure 9. VOUT tON (No Capacitor on VOUT)
TPS22933 C010_lvsb34.png
Figure 11. LOUT-VOUT vs IOUT
TPS22933 C012_lvsb34.png
Figure 13. VDOVOUT vs Temperature VIN 2.5 V
TPS22933 C008_lvsb34.png
Figure 2. RON vs VIN (Typical)
TPS22933 C001_lvsb34.png
Figure 4. IIN (Quiescent) vs VIN
TPS22933 C004_lvsb34.png
Figure 6. VOUT tOFF (1 µF on VOUT)
TPS22933 C006_lvsb34.png
Figure 8. VOUT tON (1 µF on VOUT)
TPS22933 C009_lvsb34.png
Figure 10. LOUT-VOUT vs Temperature VIN 4.2 V
TPS22933 C011_lvsb34.png
Figure 12. VDOLOUT vs Temperature VIN 2.5 V