ZHCSEQ5 August   2015 TPIC2050

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Serial I/F Write Timing Requirements
    7. 7.7 Serial I/F Read Timing Requirements
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Protect Functions
        1. 8.3.1.1 OVP
        2. 8.3.1.2 OCP and SCP
          1. 8.3.1.2.1 OCP for Step Driver
          2. 8.3.1.2.2 SCP
        3. 8.3.1.3 Thermal Protection (TSD)
        4. 8.3.1.4 Actuator Temperature Protection (ACTTIMER)
        5. 8.3.1.5 Prevent OVP 12 V (PREOVP-12V)
      2. 8.3.2 DAC Type
      3. 8.3.3 Example of 12-Bit DAC Sampling Rate for FCS/TRK/TLT
      4. 8.3.4 Digital Input Coding
    4. 8.4 Device Functional Modes
      1. 8.4.1 Differential Tilt Mode
      2. 8.4.2 Power-On Reset (POR)
        1. 8.4.2.1 RDY (Power Ready)
    5. 8.5 Programming
      1. 8.5.1 Serial Port Functional Description
      2. 8.5.2 Write Operation
      3. 8.5.3 Read Operation
      4. 8.5.4 Write and Read Operation
    6. 8.6 Register Maps
      1. 8.6.1 Register State Transition
      2. 8.6.2 DAC Register (12-Bit Write Only)
      3. 8.6.3 Control Register (8-Bit Read/Write)
      4. 8.6.4 Detailed Description of Registers
        1. 8.6.4.1  REG01 12-Bit DAC for Tilt (offset = 01h) [reset = ]
        2. 8.6.4.2  REG02 12-Bit DAC for Focus (offset = 02h) [reset = ]
        3. 8.6.4.3  REG03 12-Bit DAC for Tracking (offset = 03h) [reset = ]
        4. 8.6.4.4  REG04 12-Bit DAC for Sled1 (offset = 04h) [reset = ]
        5. 8.6.4.5  REG05 12-Bit DAC for Sled2 (offset = 05h) [reset = ]
        6. 8.6.4.6  REG06 12-Bit DAC for Stepping1 (offset = 06h) [reset = ]
        7. 8.6.4.7  REG07 12-Bit DAC for Stepping2 (offset = 07h) [reset = ]
        8. 8.6.4.8  REG08 12-Bit DAC for Spindle (offset = 08h) [reset = ]
        9. 8.6.4.9  REG09 12-Bit DAC for Load (offset = 09h) [reset = ]
        10. 8.6.4.10 REG0A 12-Bit DAC for Laser Diode Driver (offset = 0Ah) [reset = ]
        11. 8.6.4.11 REG70 8-Bit Control Register for DriverEna (offset = 70h) [reset = ]
        12. 8.6.4.12 REG71 8-Bit Control Register for FuncEna (offset = 71h) [reset = ]
        13. 8.6.4.13 REG72 8-Bit Control Register for ACTCfg (offset = 72h) [reset = ]
        14. 8.6.4.14 REG73 8-Bit Control Register for Parm0 (offset = 73h) [reset = ]
        15. 8.6.4.15 REG74 8-Bit Control Register for SIFCfg (offset = 74h) [reset = ]
        16. 8.6.4.16 REG75 8-Bit Control Register for Parm1 (offset = 75h) [reset = ]
        17. 8.6.4.17 REG76 8-Bit Control Register for WriteEna (offset = 76h) [reset = ]
        18. 8.6.4.18 REG77 8-Bit Control Register for ClrReg (offset = 77h) [reset = ]
        19. 8.6.4.19 REG78 8-Bit Control Register for ActTemp (offset = 78h) [reset = ]
        20. 8.6.4.20 REG79 8-Bit Control Register for UVLOMon (offset = 79h) [reset = ]
        21. 8.6.4.21 REG7A 8-Bit Control Register for TSDMon (offset = 7Ah) [reset = ]
        22. 8.6.4.22 REG7B 8-Bit Control Register for OCPMon (offset = 7Bh) [reset = ]
        23. 8.6.4.23 REG7C 8-Bit Control Register for TempMon (offset = 7Ch) [reset = ]
        24. 8.6.4.24 REG7E 8-Bit Control Register for Version (offset = 7Eh) [reset = ]
        25. 8.6.4.25 REG7F 8-Bit Control Register for Status (offset = 7Fh) [reset = ]
        26. 8.6.4.26 REG61 8-Bit Control Register for SPM1 (offset = 61h) [reset = ]
        27. 8.6.4.27 REG62 8-Bit Control Register for SPM2 (offset = 62h) [reset = ]
        28. 8.6.4.28 REG6B 8-Bit Control Register for DisProt (offset = 6Bh) [reset = ]
        29. 8.6.4.29 REG6C 8-Bit Control Register for STPCfg (offset = 6Ch) [reset = ]
        30. 8.6.4.30 REG6E 8-Bit Control Register for UtilCfg (offset = 6Eh) [reset = ]
        31. 8.6.4.31 REG6F 8-Bit Control Register for MonitorSet (offset = 6Fh) [reset = ]
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1  Voltage Monitoring
      2. 9.1.2  Spindle Motor Driver Operating Sequence
      3. 9.1.3  Auto Short Brake Function
      4. 9.1.4  Spindle PWM Control
      5. 9.1.5  Spindle Driver Current Limiting Circuit
      6. 9.1.6  Sled Driver Part
      7. 9.1.7  Stepping Driver Part
      8. 9.1.8  Focus/Track/Tilt Driver Part
      9. 9.1.9  Load Driver Part
      10. 9.1.10 End Detect Function
      11. 9.1.11 Load Tray Lock Detect Function
      12. 9.1.12 Three-Beam Laser Diode Driver
      13. 9.1.13 Monitor Signal on GPOUT
      14. 9.1.14 Example Timing of Target Control System
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 社区资源
    2. 12.2 商标
    3. 12.3 静电放电警告
    4. 12.4 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
5-V supply voltage P5V 6 V
12-V supply voltage P12V 15
9.5-V supply voltage A9P5V 15
Load supply P5V12 voltage 15
Spindle output peak voltage 15
Spindle output current 2.5 A
Spindle output peak current, (PW ≤ 2 ms, Duty ≤ 30%) 3.5
Sled output peak current 1.0
Focus/tracking/tilt driver output peak current 1.0
Load driver output peak current 1.0
Laser diode driver output peak current 247(3) mA
Input/output voltage –0.3 VCC + 0.3 V
Power dissipation(2) 1344 mW
Operating temperature –20 75 °C
Lead temperature 1.6 mm from case for 10 s 260
Tstg Storage temperature –60 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) A lower RθJC is attainable if the exposed pad is connected to a large copper ground plane. RθJC and RθJA are values for 56-pin TSSOP without a exposed heat slug (HSL) on bottom. Actual thermal resistance would be better than the above values.
(3) The LDD output time of the maximum current should maintain 25% or less of the xsleep total ON time.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
P5V Operating supply voltage (apply for P5V) 4.5 5.0 5.5 V
P12V Driver 12-V supply voltage (apply for P12V(1)) 10.8 12.0 13.2
A9P5V Power supply laser diode for BD (apply for A9P5V) 7.65 9.5 10.45
P5V12L Load operating supply voltage (apply for P5V12L) 4.5 5.0 5.5
10.8 12.0 13.2
VSIOV SIOV voltage 3.0 3.3 36
Tope Operating temperature range –20 25 75 °C
Fck SCLK frequency 30 33.8688 35 MHz
VSIFH SIMO, SSZ, SCLK pin 'H' level input voltage range 2.2 SIOV + 0.2 V
VSIFL SIMO, SSZ, SCLK pin 'L' level input voltage range –0.2 0.8
VIHB XRSTIN pin 'H' level input voltage 2.2 P5V + 0.1
VILB XRSTIN pin 'L' level input voltage range –0.1 0.8
ISPMOA Spindle output average current U,V,W Total) 0.5 1.7 A
ISPMO Spindle output current 1.7
ISLDOA Sled output average current 0.25 0.8
IACTOA Focus/ tracking/ tilt/ loading output average current 0.5 0.8
ISTPOA STP output average current 300 mA
(1) (P5V = 4.5 to 5.5 V, P12V = 10.8 to 13.2 V, CATA ≈ –20℃ to 75℃, unless otherwise noted)

7.4 Thermal Information

THERMAL METRIC(1) TPIC2050 UNIT
DFD (HTSSOP)
56 PINS
RθJA Junction-to-ambient thermal resistance 16.7 °C/W
RθJC Junction-to-case thermal resistance 0.8 °C/W
RθJB Junction-to-board thermal resistance 5.1 °C/W
ψJT Junction-to-top characterization parameter 0.9 °C/W
ψJB Junction-to-board characterization parameter 5.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 0.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
COMMON PART
ISTBY Standby supply current Standby mode 0.6 1.2 mA
VCV3 CV3P3 output voltage Iload = 25 mA 3.1 3.3 3.4 V
RXM XRSTIN pulldown resistor 100 200 300 kΩ
RRDY RDY pullup resistor 1.5 33 49.5
VRDY RDY low level output voltage SIOV = 3.3 V, IOL = –100 µA 0.3 V
RXFG XFG output resistor 100 200 300 Ω
VXFGH XFG high-level output voltage SIOV = 3.3 V, XSLEEP = 1, IOH = 100 µA SIOV – 0.3 V
VXFGL XFG low-level output voltage SIOV = 3.3 V, XSLEEP = 1, IOL = 100 µA 0.3
RGPO GPOUT output resistor 100 200 300 Ω
VGPOH GPOUT high-level output voltage SIOV = 3.3 V, XSLEEP = 1, GPOUT_ENA = 1, GPOUT_HL = 1, IOH = 100 µA SIOV – 0.3 V
VGPOL GPOUT low-level output voltage SIOV = 3.3 V, XSLEEP = 1, GPOUT_ENA = 1, GPOUT_HL = 0, IOH = 100 µA 0.3
TTSD Thermal protection on temperature Design value 135 150 165 °C
TSDhys Thermal protection hysteresis temperature 5 15 25
Vonvcc P5V reset on voltage 3.6 3.7 3.8 V
Voffvcc P5V reset off voltage 3.8 3.9 4.0 V
Vonvcc P12V reset on voltage 7.9 8.4 8.9 V
Voffcc P12V reset off voltage 8.3 8.8 9.3 V
VonCV3 CV3P3 reset on voltage 2.6 2.7 2.8 V
VoffCV3 CV3P3 reset off voltage 2.7 2.8 2.9 V
VovpPspmOn OVP predetection voltage (spindle) 13.4 14.1 14.8(1) V
VovpPspmOff OVP prerelease voltage (spindle) 13.1 13.8 14.5(1) V
VovpspmOn OVP detection voltage (spindle) 14.2 14.9 15.6(1) V
VovpspmOff OVP release voltage (spindle) 13.9 14.6 15.3(1) V
VovpOn OVP detection voltage (except spindle) 6.0 6.2 6.4(1) V
VovpOff OVP release voltage (except spindle) 5.8 6.0 6.2(1) V
CHARGE PUMP PART
FCHGP Frequency XSLEEP = 1 132.6 156 179.4 kHz
VCHGP Output voltage Ccp1 = Ccp3 = 0.1 µF Io = –1 mA 15.6 18.5 21.4 V
SPINDLE MOTOR DRIVER PART
RttlSPM Total output resistance high side + low side IOUT = 500 mA 0.3 0.6 Ω
VIsns Spindle current limit reference voltage 160 170 180 mV
VIsnsP For flash peak current detection 179 194 209
ResSPM Resolution 12 bit
VoutSPM Spindle gain Magnification to 1.0 inputs 12.4 14.0 15.6 times
WidDZSPM Spindle dead band Forward 12h 52h 92h
Reverse –92h –52h –12h
SLED MOTOR DRIVER PART
RttlSLD Total output resistance high side + low side P12V = 10.8 to 13.2 V, IO = 500 mA 1.6 2.5 Ω
ResSLD Resolution 10 bit
WidDZSLD Input dead band Forward +4h +33h +62h
Reverse –62h –33h –4h
GnSLD Sled current gain P5V = 5 V, P12V = 12 V VSLED = 7FFh 760 880 1000 mA
VthEdetSLD END_DET BEMF threshold voltage ENDDET_SLCT = 0, SLEDENDTH<1:0> = ,SLED Enable 62 124 186 mV
FOCUS/TILT/TRACKING DRIVER PART
RttlAct Each channel total output resistance high side + low side P5V = 4.5 V to 5.5 V, IO = 500 mA 0.7 1.1 Ω
ResACT Resolution 12 bit
VOfstACT Each channel output offset voltage DAC_code = 000h –30 0 30 mV
GnAct Each channel voltage gain Magnification to 1.0 inputs 4.7 6.0 7.6 times
LOAD DRIVER PART
RttlLOD Total output resistance high side + low side P5V12L = 4.5 to 5.5 V, IO = 500 mA 1.2 1.9 Ω
P5V12L = 10.8 to 13.2 V, IO = 500 mA
ResLOD Resolution 12 bit
GnLOD Voltage gain P5V12L = 4.5 to 5.5 V 4.7 6.0 7.6 V
P5V12L = 10.8 to 13.2 V 11.1 14.0 17.6
WidDZLOD Dead band Forward 20h
Reverse –21h
LockDth Tray lock detect threshold current P5V12L = 5 V, TRAY_LOCKDET[2:0] = 1 80 100 120 mA
P5V12L = 12 V, TRAY_LOCKDET[2:0] = 1 80 100 120
P5V12L = 5 V, TRAY_LOCKDET[2:0] = 2 120 150 180
P5V12L = 12 V, TRAY_LOCKDET[2:0] = 2 120 150 180
P5V12L = 5 V, TRAY_LOCKDET[2:0] = 3 160 200 240
P5V12L = 12 V, TRAY_LOCKDET[2:0] = 3 160 200 240
P5V12L = 5 V, TRAY_LOCKDET[2:0] = 4 212 250 287
P5V12L = 12 V, TRAY_LOCKDET[2:0] = 4 212 250 287
P5V12L = 5 V, TRAY_LOCKDET[2:0] = 5 255 300 345
P5V12L = 12 V, TRAY_LOCKDET[2:0] = 5 255 300 345
P5V12L = 5 V, TRAY_LOCKDET[2:0] = 6 297 300 345
P5V12L = 12 V, TRAY_LOCKDET[2:0] = 6 297 300 345
P5V12L = 5 V, TRAY_LOCKDET[2:0] = 7 340 400 460
P5V12L = 12 V, TRAY_LOCKDET[2:0] = 7 340 400 460
STEPPING MOTOR DRIVER PART
RttlSTP Total output resistance high side + low side IO = 100 mA 1.0 1.5 Ω
ResSTP Resolution 8 bit
IocpSTP Overcurrent protection level 595 850 1148(1) mA
tDlyocpSTP OCP monitor delay time 0.7 1.0 1.3(1) µs
thlocpSTP OCP hold time 17 25 32(1) ms
VthEdetSTP END_DET threshold level ENDDET_SLCT = 1, STPDENDTH<1:0> = 00, STP Enable 19 39 59 mV
LDD DRIVER PART
AV(2) LDD current gain in digital mode
VLDD = 0x7FF
IUP = 00 		LDD_MSEL:01(CD), 10(DVD) A9P5V = 7.65 to 10.45 V 102 120 138 mA
LDD_MSEL:11(BD) A9P5V = 8.55 to 10.45 V 102 120 138
LDD_MSEL:11(BD) A9P5V = 7.65 to 8.55 V 98 120 141
AV(2) LDD current gain in analog mode
VLDDIN input voltage = 3 V
IUP = 00 		LDD_MSEL:01(CD), 10(DVD) A9P5V = 7.65 to 10.45 V 102 120 138 mA
LDD_MSEL:11(BD) A9P5V = 8.55 to 10.45 V 102 120 138
LDD_MSEL:11(BD) A9P5V = 7.65 to 8.55 V 98 120 141
AV(2)(3) LDD current gain by IUP setting (digital mode only)
LDD_MSEL: 01(CD), 10(DVD) 		VLDD = 0x7FF, LDD_IUP = 00 102 120 138 mA
VLDD = 0, LDD_IUP = 00 –10 0 10
VLDD = 0x7FF, LDD_IUP = 01 119 149 178
VLDD = 0x7FF, LDD_IUP = 10 141 177 212
VLDD = 0x7FF, LDD_IUP = 11 164 206 247
AV(2)(3) LDD current gain by IUP setting (digital mode only)
LDD_MSEL:11(BD) at A9P5V = 8.55 to 10.45 V 		VLDD = 0x7FF, LDD_IUP = 00 102 120 138 mA
VLDD = 0, LDD_IUP = 00 –10 0 10
VLDD = 0x7FF, LDD_IUP = 01 119 149 178
VLDD = 0x7FF, LDD_IUP = 10 141 177 212
VLDD = 0x7FF, LDD_IUP = 011 164 206 247
AV(2)(3) LDD current gain by IUP setting (digital mode only)
LDD_MSEL:11(BD) at A9P5V = 7.65 to 8.55 V 		VLDD = 0x7FF, LDD_IUP = 00 98 120 141 mA
VLDD = 0, LDD_IUP = 00 –10 0 10
VLDD = 0x7FF, LDD_IUP = 01 114 149 183
VLDD = 0x7FF, LDD_IUP = 10 136 177 217
VLDD = 0x7FF, LDD_IUP = 11 158 206 253
ResLDD LDD current gain P5V = 4.5 V to 5.5 V, A9P5V = 9.5 V 11 bit
tr Rise time of ILDD P5V = 5 V VLDDIN = 0 → 0x7FF
120 mA 		162 203 243 µs
tf Fall time of ILDD P5V = 5 V VLDDIN = 　0x7FF → 0
50 mA 		162 203 243
IZ VLDDIN input impedance 100 200 300 kΩ
LDDdbA Low voltage dead band 140 200 260 mV
LDDdbA 0x3F bit
THERMOMETER PART
ResTEMP Resolution 6 bit
Trng Temperature range CHIPTEMP[5:0] = 00 8 15 22 °C
CHIPTEMP[5:0] = 3Fh 155 165 175
FTEMP Update cycle 10 kHz
ACTUATOR PROTECTION
tintACTTEMP Update cycle 26 ms
SERIAL PORT VOLTAGE LEVELS
SOMI High-level output voltage, VOH IOH = 1 mA 80% SIOV V
SOMI Low-level output voltage, VOL IOL = 1 mA 20% SIOV V
SIMO High-level input voltage, VIH 70% SIOV V
SIMO Low-level input voltage, VIL 20% SIOV V
tSIMO Input rise/fall time 20% ⇔ 80% SIOV 3.5 ns
tSOMI Output rise/fall time(4) Cload = 30 pF, 20% ⇔ 80% SIOV 10 ns
RSCLK Internal pulldown resistance 100 200 300 kΩ
RSSZ Internal pullup resistance 100 200 300 kΩ
(1) These value are protection functions only, and stress beyond those listed under Recommended Operating Conditions may cause permanent damage to the device.
(2) ILDD_BD = 4.5 V, ILDD_CD = 2.1 V ILDD_DVD = 2.1 V
(3) LDD_IUP settings are only for digital mode.
(4) Specified by design

7.6 Serial I/F Write Timing Requirements

MIN NOM MAX UNIT
ƒck SCLK clock frequency SIOV = 3.3 V 35 MHz
tckl SCLK low time 11 ns
tckh SCLK high time 11 ns
tsens SSZ setup time 7 ns
tsenh SSZ hold time 7 ns
tsl SSZ disable high time 11 ns
tds SIMO setup time (Write) 7 ns
tdh SIMO hold time (Write) 7 ns
TPIC2050 slis167_ser_port_write_tim.gif Figure 1. Serial Port Write Timing

7.7 Serial I/F Read Timing Requirements

MIN NOM MAX UNIT
ƒck SCLK clock frequency SIOV = 3.3 V 35 MHz
tckl SCLK low time 11 ns
tckh SCLK high time 11 ns
tsens SSZ setup time 7 ns
tsenh SSZ hold time 7 ns
tsl SSZ disable high time 11 ns
tds SIMO setup time (Write) 7 ns
tdh SIMO hold time (Write) 7 ns
trdly SOMI delay time (Read) CLOAD = 10 pF, SIOV = 3.3 V 2 9 ns
tsendl SOMI hold time (Read) CLOAD = 10 pF, SIOV = 3.3 V 2 9 ns
trls SOMI release time (Read) CLOAD = 10 pF, SIOV = 3.3 V from SSZ rise to SOMI HIZ 0 9 ns
TPIC2050 slis167_ser_port_read_tim.gif Figure 2. Serial Port Read Timings
TPIC2050 slis167_ser_port_read_tim_adv_mode.gif Figure 3. Serial Port Read Timings (Advanced Read Mode)

7.8 Typical Characteristics

TPIC2050 D001_SLIS167.gif
Figure 4. STP1 Driver: DAC Code vs Output On Duty
TPIC2050 D002_SLIS167.gif
Figure 5. STP2 Driver: DAC Code vs Output On Duty