7.1 Overview

The TPD5E003 is a five-channel ESD protection device. Each channel has ±15 kV contact and ±15 kV air-gap IEC ESD performance. When TPD5E003 is used in the unidirectional clamping configuration, it stays inactive from 0 V to 5 V and has low leakage. When the voltages on the I/O lines exceed the breakdown voltage, it starts to clamp and thus, keep the I/O line voltages low. Same mechanism applies to the bidirectional configuration where one of the channels is used as the ground pin and the other four are connected to I/O. The low leakage inactive range in bidirectional configuration is from –5 V to 5 V. The compact DPF package helps save board area. Typical application interfaces include SIM card interfaces, audio lines (mics, earphones, and speakerphones), SD interfaces, and keypads, or other buttons. Typical end equipment includes cell phones, tablets, remote controllers, and wearables.

7.2 Functional Block Diagram

7.3 Feature Description

TPD5E003 is a robust ESD protection device. Each of the five channels has ±15 kV contact and ±15 kV air-gap IEC ESD performance. This and the low dynamic resistance ensure the circuits protected by it only see a low residual transient pulse during the ESD. A typical I/O capacitance of 7 pF makes sure that this device is suitable to be used in a wide frequency range of the applications. The capacitance is even smaller when used in the bidirectional configuration, thus can be used for even higher frequencies. Low leakage current can keep the unnecessary power dissipation low during the normal operation. The industrial temperature range of –40°C to 125°C makes this device suitable for a wide applications range including consumer electronics, industrial and automotive. With the robust design, TPD5E003 is able to take 3 A of 8/20 µs surge current (40 W). The small package saves the board area and the pinout makes it easy to route.

7.4 Device Functional Modes

Each channel of TPD5E003 is a passive clamp that has low leakage during normal operation when the voltage between I/O pin and GND is below V_RWM and activates when it goes above V_BR. During IEC ESD events (contact and air-gap), transient voltages as high as ±15 kV can be clamped. When the voltages on the protected lines fall below the trigger voltage, the device reverts back to the low leakage passive state.