ZHCS824D March   2012  – October 2015 TPD13S523

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 IEC 61000-4-2 Protection
      2. 7.3.2 Single-Chip ESD Solution
      3. 7.3.3 On-Chip 5-V Load Switch
      4. 7.3.4 Supports UTILITY Line Protection
      5. 7.3.5 < 0.05-pF Differential Capacitance Between TMDS Pairs
      6. 7.3.6 Industry Standard Package and Space-Saving Package
      7. 7.3.7 Supports Data Rates in Excess of 3.4 Gbps
      8. 7.3.8 RDYN = 0.5 Ω
      9. 7.3.9 Commercial Temperature Range
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 5V_SUPPLY Voltage Range
        2. 8.2.2.2 Maximum HDMI Data Rate
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11器件和文档支持
    1. 11.1 社区资源
    2. 11.2 商标
    3. 11.3 静电放电警告
    4. 11.4 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Specifications

Absolute Maximum Ratings

TA = –40°C to 85°C (1)
MIN MAX UNIT
VCC voltage tolerance 5V_SUPPLY –0.3 6 V
IO voltage tolerance Connector pins(2) –0.3 6 V
IEC 61000-4-5 peak current (8/20 µs) Connector pins(2) 3 A
IEC 61000-4-5 peak power (8/20 µs) Connector pins(2) 30 W
Storage temperature, Tstg –65 125 °C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Connector pins are Dx+, Dx–, CTRLx, and 5V_OUT

ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±500
IEC 61000-4-2 Contact Discharge ±12000
IEC 61000-4-2 Air-gap Discharge ±14000
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

Recommended Operating Conditions

TA = –40°C to 85°C
MIN MAX UNIT
VCC Voltage 5V_SUPPLY 4.5 5.5 V
IO voltage at external signal pins Signal Pins(1) –0.3 5.5 V
Operating free-air temperature –40 85 °C
External Signal pins are Dx+, Dx–, CTRLx, and 5V_OUT

Thermal Information

THERMAL METRIC(1) TPD13S523 UNIT
PW [TSSOP] RSV [UQFN]
16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 119.9 153.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 54.5 70.9 °C/W
RθJB Junction-to-board thermal resistance 65.0 74.7 °C/W
ψJT Junction-to-top characterization parameter 9.7 2.9 °C/W
ψJB Junction-to-board characterization parameter n/a 74.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

Electrical Characteristics

TA = –40°C to 85°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
LOAD SWITCH
ICC Supply current at 5V_SUPPLY 5V_SUPPLY =5V, 5V OUT = Open 6.5 7 10 µA
ISC Short-circuit current at 5V_OUT 5V_SUPPLY =5V, 5V_OUT = GND 100 116 147 mA
IBACKDRIVE Reverse leakage current at 5VOUT 5V_SUPPLY =0V, 5V_OUT = 5 V 0.01 0.69 µA
VDROP 5V_OUT output voltage drop 5V_SUPPLY =5V, I5V_OUT = 55 mA 170 205 mV
CONNECTOR PINS
VRWM Reverse stand-off voltage 5.5 V
VCLAMP Clamp voltage with ESD strike Ipp = 1 A, 8/20 μs(1) 13 V
Ipp = 3 A, 8/20 μs(1) 15
IIO Leakage current through external signal pins(3) 5V_SUPPLY =5V, VIO = 5 V 2 7 65 nA
IOFF Current from IO Port to supply pins when powered down through signal pins(2) 5V_SUPPLY = 0 V, VIO = 2.5 V 1 5 44 nA
VF Diode forward voltage through external signal pins(3); lower clamp diode ID = 8 mA 0.7 0.85 0.95 V
RDYN Dynamic resistance of ESD clamps external pins(2) Pin to ground(3) 0.5 Ω
CIO_TMDS IO capacitance Dx+, Dx– pins to GND 5V_SUPPLY = 5 V, VIO = 2.5 V;
ƒ = 1 MHz
1 pF
ΔCIO_TMDS Differential capacitance for the Dx+, Dx– lines 5V_SUPPLY = 5 V, VIO = 2.5 V;
ƒ = 1 MHz
0.05 pF
CIO_CONTROL CTRLx pin capacitance 5V_SUPPLY = 5 V, VIO = 2.5 V;
ƒ = 1 MHz
1 pF
VBR Break-down voltage through signal pins(2) IIO = 1 mA 6 V
Non-repetitive current pulse of an 8/20 µs exponentially decaying waveform according to IEC 61000-4-5.
Signal pins are Dx+, Dx–, and CTRLx.
Extraction of RDYN using least squares fit of TLP characteristics between I=1A AND I=10A.

Typical Characteristics

TPD13S523 cap_vbias_lvsbc5.gif Figure 1. Pin Capacitance
TPD13S523 pos_clamp_lvsbc5.gif Figure 3. IEC Positive Clamping Waveform Using 8-kV Contact
TPD13S523 TLP_plot_lvsbc5.gif Figure 5. TLP Plot On Connector Pins
TPD13S523 load_swt_lvsbc5.gif
CIN = 1 µF COUT = 1µF ISWITCH = 55 mA
TA = 25°C
Figure 7. Load Switch Start-Up Transient Waveform
TPD13S523 res_ta_lvsbc5.gif Figure 9. Load Switch Resistance vs Temperature
TPD13S523 Ipp_Ppp_wf_lvsbc5.gif Figure 2. IEC 61000-4-5 (Surge) IPP and PPP Waveform
TPD13S523 neg_clamp_lvsbc5.gif Figure 4. IEC Negative Clamping Waveform Using –8-kV Contact
TPD13S523 diode_curve_lvsbc5.gif Figure 6. IV Curve On Signal Pins
TPD13S523 cur_ta_lvsbc5.gif
5V_SUPPLY = 5 V 5V_OUT = Open
Figure 8. Load Switch Supply Current