11.1 Layout Guidelines
Exposed Pad On TPA6130A2RTJ Package Option:
- Solder the exposed metal pad on the TPA6130A2RTJ QFN package to the a pad on the PCB. The pad on the PCB may be grounded or may be allowed to float (not be connected to ground or power).
- If the pad is grounded, it must be connected to the same ground as the GND pins (3, 9, 10, 13, and 19).
- Soldering the thermal pad improves mechanical reliability, improves grounding of the device, and enhances thermal conductivity of the package.
- The GND pin for charge pump should be decoupled to the charge pump VDD pin, and the GND pin adjacent to the Analog VDD pin should be separately decoupled to each other.