ZHCSIX6B October   2018  – Sept 2019 TMUX1574

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      应用示例
      2.      方框图
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Dynamic Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
      1. 6.8.1 Eye Diagrams
  7. Parameter Measurement Information
    1. 7.1  On-Resistance
    2. 7.2  Off-Leakage Current
    3. 7.3  On-Leakage Current
    4. 7.4  IPOFF Leakage Current
    5. 7.5  Transition Time
    6. 7.6  tON (EN) and tOFF (EN) Time
    7. 7.7  tON (VDD) and tOFF (VDD) Time
    8. 7.8  Break-Before-Make Delay
    9. 7.9  Propagation Delay
    10. 7.10 Skew
    11. 7.11 Charge Injection
    12. 7.12 Capacitance
    13. 7.13 Off Isolation
    14. 7.14 Channel-to-Channel Crosstalk
    15. 7.15 Bandwidth
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bidirectional Operation
      2. 8.3.2 Beyond Supply Operation
      3. 8.3.3 1.8 V Logic Compatible Inputs
      4. 8.3.4 Powered-off Protection
      5. 8.3.5 Fail-Safe Logic
      6. 8.3.6 Low Capacitance
      7. 8.3.7 Integrated Pull-Down Resistors
    4. 8.4 Device Functional Modes
    5. 8.5 Truth Tables
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Electrical Characteristics

VDD = 1.5 V to 5.5 V, GND = 0V, TA = –40°C to +125°C
Typical values are at VDD = 3.3 V, TA = 25°C, (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POWER SUPPLY
VDD Power supply voltage 1.5 5.5 V
IDD Active supply current VSEL = 0 V, 1.4V or VDD
VS = 0 V to 5.5 V
40 68 μA
IDD_STANDBY Supply current when disabled VEN = 1.4V or VDD
VS = 0 V to 5.5 V
7.5 15 µA
DC CHARACTERISTICS
RON On-resistance VS = 0 V to VDD*2
VS(max) = 5.5 V
ISD = 8 mA
Refer to ON-State Resistance Figure
2 4.5
ΔRON On-resistance match between channels VS = VDD
ISD = 8 mA
Refer to ON-State Resistance Figure
0.07 0.28
RON (FLAT)  On-resistance flatness VS = 0 V to VDD
ISD = 8 mA
Refer to ON-State Resistance Figure
1 1.8
IPOFF Powered-off I/O pin leakage current VDD =  0 V
V=  0 V to 3 V
VD = 0 V
TA = 25℃
Refer to Ipoff Leakage Figure
–10 0.01 10 nA
IPOFF Powered-off I/O pin leakage current VDD =  0 V
V=  0 V to 3.6 V
VD = 0 V
Refer to Ipoff Leakage Figure
–2 0.01 2 µA
IS(OFF)
ID(OFF)
OFF leakage current Switch Off
VD = 0.8*VDD / 0.2*VDD
VS = 0.2*VDD / 0.8*VDD
Refer to Off Leakage Figure
–100 0.03 100 nA
ID(ON)
IS(ON)
ON leakage current Switch On
VD = 0.8*VDD / 0.2*VDD, S pins floating
or
VS = 0.8*VDD / 0.2*VDD, D pins floating
Refer to On Leakage Figure
–50 0.01 50 nA
LOGIC INPUTS
VIH Input logic high 1.2 5.5 V
VIL Input logic low 0 0.45 V
IIH Input high leakage current VSEL = 1.8 V, VDD 1 ±2 μA
IIL Input low leakage current VSEL = 0 V 0.2 ±2 μA
RPD Internal pull-down resistor on logic pins 6
CI Logic input capacitance VSEL = 0 V, 1.8 V or VDD
f = 1 MHz
3 pF