ZHCSGX3E august   2017  – june 2023 TMUX136

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Dynamic Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Low Power Mode
    4. 8.4 Device Functional Modes
      1. 8.4.1 High Impedance Mode
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RSE|10
散热焊盘机械数据 (封装 | 引脚)
订购信息

Thermal Information

THERMAL METRIC (1)TMUX136UNIT
RSE (UQFN)
10 PINS
RθJAJunction-to-ambient thermal resistance191.6°C/W
RθJC(top)Junction-to-case (top) thermal resistance94.3°C/W
RθJBJunction-to-board thermal resistance117.5°C/W
ψJTJunction-to-top characterization parameter7.4°C/W
ψJBJunction-to-board characterization parameter117.4°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.