ZHCSCZ4C October   2014  – September 2018 TMP302-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      跳变阈值精度
  4. 4 修订历史记录
  5. 5 器件比较表
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 HYSTSET
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Configuring the TMP302-Q1
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 接收文档更新通知
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from B Revision (July 2015) to C Revision

  • Changed the supply voltage maximum value from: 3.6 V to: 4 VGo
  • Changed the input pin supply voltage maximum value from: VS + 0.5 V to: VS + 0.3 and ≤ 4 VGo
  • Changed the output pin voltage maximum value from: 3.6 V to: 4 VGo
  • Added the specified temperature to the Recommended Operating Conditions table Go
  • Updated junction-to-ambient thermal resistance from 200 to 210.3 Go
  • Updated junction-to-case (top) thermal resistance from 73.7 to 105.0 Go
  • Updated junction-to-board thermal resistance from 34.4 to 87.5 Go
  • Updated junction-to-top characterization parameter from 3.1 to 6.1 Go
  • Updated junction-to-board characterization parameter from 34.2 to 87.0 Go
  • Changed the Design Requirements section Go
  • 添加了接收文档更新通知 部分Go

Changes from A Revision (November 2014) to B Revision

  • Changed the Handling Ratings table to ESD Ratings and moved storage temperature to the Absolute Maximum Ratings table Go

Changes from * Revision (October 2014) to A Revision

  • 将器件状态从“产品预览”更改为“生产”Go