ZHCSP76
November 2021
TMAG5124-Q1
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Revision History
5
Device Comparison
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Magnetic Characteristics
7.7
Typical Characteristics
7.7.1
TMAG5124A and TMAG5124E
7.7.2
TMAG5124B and TMAG5124F
7.7.3
TMAG5124C and TMAG5124G
7.7.4
TMAG5124D and TMAG5124H
7.7.5
Current Output Level
7.7.5.1
Low-Level Current Output for TMAG5124A/B/C/D
7.7.5.2
Low-Level Current Output for TMAG5124E/F/G/H
7.7.5.3
High-Level Current Output for Every Version
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Field Direction Definition
8.3.2
Device Output
8.3.3
Protection Circuits
8.3.3.1
Load Dump Protection
8.3.3.2
Reverse Polarity Protection
8.3.4
Power-On Time
8.3.5
Hall Element Location
8.3.6
Propagation Delay
8.3.7
Chopper Stabilization
8.4
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.2
Typical Applications
9.2.1
High-Side and Low-Side Typical Application Diagrams
9.2.1.1
Design Requirements
9.2.1.2
Detailed Design Procedure
9.2.1.3
Application Curve
10
Power Supply Recommendations
10.1
Power Derating
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Documentation Support
12.2
接收文档更新通知
12.3
支持资源
12.4
Trademarks
12.5
静电放电警告
12.6
术语表
13
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
DBZ|3
MPDS108E
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsp76_oa
zhcsp76_pm
12.5
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。