ZHCSNY5
May 2021
TMAG5123
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Device Comparison Table
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Magnetic Characteristics
7.7
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Field Direction Definition
8.3.2
Device Output
8.3.3
Protection Circuits
8.3.3.1
Load Dump Protection
8.3.3.2
Reverse Supply Protection
8.3.4
Hall Element Location
8.3.5
Power-On Time
8.3.6
Propagation Delay
8.3.7
Chopper Stabilization
8.4
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.2
Typical Applications
9.2.1
In-Plane Typical Application Diagrams
9.2.1.1
Design Requirements
9.2.1.2
Detailed Design Procedure
9.2.1.3
Application Curve
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
接收文档更新通知
12.2
支持资源
12.3
Trademarks
12.4
静电放电警告
12.5
术语表
13
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
DBZ|3
MPDS108E
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsny5_oa
9.2.1
In-Plane Typical Application Diagrams
Figure 9-1
Typical In-Plane Sensing Diagram