ZHCSJ62D December 2017 – July 2021 TLV767
PRODUCTION DATA
The device contains a thermal
shutdown protection circuit to disable the device when the junction
temperature
(TJ) of the pass
transistor rises to TSD(shutdown) (typical). Thermal shutdown
hysteresis assures that the device resets (turns on) when the temperature
falls to TSD(reset) (typical).
The thermal time-constant of the semiconductor die is fairly short, thus the device may cycle on and off when thermal shutdown is reached until power dissipation is reduced. Power dissipation during start up can be high from large VIN – VOUT voltage drops across the device or from high inrush currents charging large output capacitors. Under some conditions, the thermal shutdown protection disables the device before start up completes.
For reliable operation, limit the junction temperature to the maximum listed in the Recommended Operating Conditions table. Operation above this maximum temperature causes the device to exceed its operational specifications. Although the internal protection circuitry of the device is designed to protect against thermal overall conditions, this circuitry is not intended to replace proper heat sinking. Continuously running the device into thermal shutdown or above the maximum recommended junction temperature reduces long-term reliability.