ZHCSL29A
April 2020 – December 2020
TLV767-Q1
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagrams
7.3
Feature Description
7.3.1
Output Enable
7.3.2
Dropout Voltage
7.3.3
Foldback Current Limit
7.3.4
Undervoltage Lockout (UVLO)
7.3.5
Output Pulldown
7.3.6
Thermal Shutdown
7.4
Device Functional Modes
7.4.1
Device Functional Mode Comparison
7.4.2
Normal Operation
7.4.3
Dropout Operation
7.4.4
Disabled
8
Application and Implementation
8.1
Application Information
8.1.1
Adjustable Device Feedback Resistors
8.1.2
Recommended Capacitor Types
8.1.3
Input and Output Capacitor Requirements
8.1.4
Reverse Current
8.1.5
Feed-Forward Capacitor (CFF)
8.1.6
Power Dissipation (PD)
8.1.7
Estimating Junction Temperature
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Transient Response
8.2.2.2
Choose Feedback Resistors
8.2.3
Application Curves
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Examples
11
Device and Documentation Support
11.1
Device Support
11.1.1
Device Nomenclature
11.2
Documentation Support
11.2.1
Related Documentation
11.3
Receiving Notification of Documentation Updates
11.4
Support Resources
11.5
Trademarks
11.6
Electrostatic Discharge Caution
11.7
Glossary
12
Mechanical, Packaging, and Orderable Information
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
DRB|8
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsl29a_oa
zhcsl29a_pm
11.7
Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.