ZHCSKJ1A December   2019  – February 2020 TLV751

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      典型应用
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout (UVLO)
      2. 7.3.2 Shutdown
      3. 7.3.3 Foldback Current Limit
      4. 7.3.4 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Adjustable Device Feedback Resistors
      2. 8.1.2 Input and Output Capacitor Selection
      3. 8.1.3 Dropout Voltage
      4. 8.1.4 Exiting Dropout
      5. 8.1.5 Reverse Current
      6. 8.1.6 Power Dissipation (PD)
      7. 8.1.7 Feed-Forward Capacitor (CFF)
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Current
        2. 8.2.2.2 Thermal Dissipation
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 器件命名规则
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Electrical Characteristics

At operating temperature range (TJ = –40°C to +125°C),VIN = VOUT(NOM) + 0.5 V or 1.5 V (whichever isgreater), IOUT = 1 mA, VEN =VIN, and CIN = COUT = 1 uF(unless otherwise noted); all typical values are at TJ = 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VFB Feedback voltage TJ = 25°C 0.55 V
Output accuracy(1) T= 25°C –0.5% 0.5%
–40°C ≤ TJ ≤ +125°C; VOUT(NOM) + 0.5 V(2) ≤ VIN ≤ 6.0 V –1.5% 1.5%
Line regulation VOUT(NOM) + 0.5 V(2) ≤ VIN ≤ 6.0 V 2 mV
Load regulation 0.1 mA ≤ IOUT ≤ 500 mA, VIN =  VOUT + 0.5 V(3) 0.030 V/A
IGND Ground current IOUT = 0 mA TJ = 25°C 10 25 31 µA
–40°C ≤ TJ ≤ +125°C 35 µA
ISHDN Shutdown current VEN ≤ 0.3 V, 1.5 V ≤ VIN ≤ 6.0 V 0.1 1 µA
IFB Feedback pin current 0.01 0.1 µA
ICL Output current limit VIN = 2 V with VOUT < 1 V;
otherwise VIN = VOUT(NOM) + 1.0 V
VOUT = VOUT(NOM) – 0.2 V,
VOUT < 1.5 V
530 720 865 mA
VOUT = 0.9 V × VOUT(NOM),
VOUT ≥ 1.5 V
530 720 865
ISC Short-circuit current limit VIN = 2 V with VOUT < 1 V;
otherwise VIN = VOUT(NOM) + 1.0 V
VOUT = 0 V 310 400 mA
VDO Dropout voltage IOUT = 500 mA,
–40°C ≤ TJ ≤ +125°C,
VOUT = 0.95 × VOUT(NOM)
0.65 V ≤ VOUT < 0.8 V 720 880 mV
0.8 V ≤ VOUT < 1.0 V 585 750
1.0 V ≤ VOUT < 1.2 V 420 570
1.2 V ≤ VOUT < 1.5 V 285 400
1.5 V ≤ VOUT < 1.8 V 180 240
1.8 V ≤ VOUT < 2.5 V 140 190
2.5 V ≤ VOUT < 3.3 V 102 140
3.3 V ≤ VOUT ≤ 5.5 V 95 130
PSRR Power-supply rejection ratio VIN = VOUT(NOM) + 1.0 V,
IOUT = 50 mA
f = 1 kHz 50 dB
f = 100 kHz 45
f = 1 MHz 30
Vn Output noise voltage BW = 10 Hz to 100 kHz, VOUT = 0.9 V 53 µVRMS
VUVLO Undervoltage lockout VIN rising 1.21 1.33 1.47 V
VIN falling 1.17 1.29 1.42 V
VUVLO, HYST Undervoltage lockout hysteresis VIN hysteresis 45 mV
tSTR Startup time From EN low-to-high transition to VOUT = VOUT(NOM) × 95% 500 700 µs
VEN(HI) EN pin high voltage 1.0 V
VEN(LO) EN pin low voltage  0.3 V
IEN Enable pin current VIN = EN = 6.0 V 10 nA
RPULL DOWN Pulldown resistance VIN = 6.0 V 95 Ω
TSD Thermal shutdown Shutdown, temperature increasing 170 °C
Reset, temperature decreasing 155
When the device is connected to external feedback resistors at the FB pin, external resistor tolerances are not included.
VIN = 1.5 V for VOUT < 1.0 V.
VIN = 2.0 V for VOUT < 1.5 V.