ZHCSMU4B february   2022  – june 2023 TIOS102 , TIOS1023 , TIOS1025

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings - IEC Specifications
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1  Current Limit Configuration
      2. 8.3.2  Current Fault Detection, Indication and Auto Recovery
      3. 8.3.3  Thermal Warning, Thermal Shutdown
      4. 8.3.4  Fault Reporting (NFAULT)
      5. 8.3.5  Device Function Tables
      6. 8.3.6  The Integrated Voltage Regulator (LDO)
      7. 8.3.7  Reverse Polarity Protection
      8. 8.3.8  Integrated Surge Protection and Transient Waveform Tolerance
      9. 8.3.9  Power Up Sequence
      10. 8.3.10 Undervoltage Lock-Out (UVLO)
    4. 8.4 Device Functional Modes
      1. 8.4.1 NPN Configuration (N-Switch Mode)
      2. 8.4.2 PNP Configuration (P-Switch Mode)
      3. 8.4.3 Push-Pull Mode
  10. Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 最高结温检查
        2. 9.2.2.2 Driving Capacitive Loads
        3. 9.2.2.3 Driving Inductive Loads
      3. 9.2.3 Application Curves
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 接收文档更新通知
    2. 12.2 支持资源
    3. 12.3 Trademarks
    4. 12.4 静电放电警告
    5. 12.5 术语表
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical Data

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Layout Guidelines

  • Use of a 4-layer board is recommended for good heat conduction. Use layer 1 (top layer) for control signals, layer 2 as GND, layer 3 for the 24-V supply plane (VCC), and layer 4 for the regulated output supply (VCC_IN/OUT).
  • Connect the thermal pad to GND with maximum amount of thermal vias for best thermal performance.
  • Use entire planes for VCC, VCC_IN/OUT and GND to assure minimum inductance.
  • The VCC terminal must be decoupled to ground with a low-ESR ceramic decoupling capacitor with a minimum value of 100 nF. The capacitor must have a voltage rating of 50 V minimum (100 V depending on max sensor supply fault rating) and an X5R or X7R dielectric.
  • • The optimum placement of the capacitor is closest to the VCC and GND terminals to reduce supply drops during large supply current loads. See Figure 11-1 for a PCB layout example.
  • Connect all open-drain control outputs via 10 kΩ pull-up resistors to the VCC_IN/OUT plane to provide a defined voltage potential to the system controller inputs when the outputs are high-impedance.
  • Connect the RSET resistor between ILIM_ADJ and GND.
  • Decouple the regulated output voltage at VCC_IN/OUT to ground with a low-ESR, 1 μF, ceramic decoupling capacitor. The capacitor should have a voltage rating of 10 V minimum and an X5R or X7R dielectric.