ZHCSRC5K september   2003  – april 2023 THS3091 , THS3095

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 描述
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: VS = ±15 V
    6. 7.6 Electrical Characteristics: VS = ±5 V
    7. 7.7 Typical Characteristics: ±15 V
    8. 7.8 Typical Characteristics: ±5 V
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power-Down and Reference Pins Functionality
    4. 8.4 Device Functional Modes
      1. 8.4.1 Wideband, Noninverting Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 PowerPAD Design Considerations
          1. 9.4.1.1.1 PowerPAD Layout Considerations
        2. 9.4.1.2 Power Dissipation and Thermal Considerations
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 接收文档更新通知
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
  11. 11Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

9.4.1.2 Power Dissipation and Thermal Considerations

The THS309x incorporates automatic thermal shutoff protection. This protection circuitry shuts down the amplifier if the junction temperature exceeds approximately 160°C. When the junction temperature reduces to approximately 140°C, the amplifier turns on again. But, for maximum performance and reliability, the designer must ensure that the design does not exceed a junction temperature of 125°C. Between 125°C and 150°C, damage does not occur, but the performance of the amplifier begins to degrade and long-term reliability suffers. The thermal characteristics of the device are dictated by the package and the PCB. Maximum power dissipation for a given package is calculated using the following equation:

Equation 6. P D m a x   =   T m a x   -   T A θ J A

Where:

  • PDmax is the maximum power dissipation in the amplifier (W).
  • Tmax is the absolute maximum junction temperature (°C)
  • TA is the ambient temperature (°C)
  • θJA = θJC + θCA
  • θJC is the thermal coefficient from the silicon junctions to the case (°C/W)
  • θCA is the thermal coefficient from the case to ambient air (°C/W)

For systems where heat dissipation is more critical, the THS3091 and THS3095 are offered in an 8-pin SOIC (DDA) with PowerPAD package. The thermal coefficient for the PowerPAD packages are substantially improved over the traditional SOIC. The data for the PowerPAD packages assume a board layout that follows the PowerPAD layout guidelines referenced above and detailed in the PowerPAD™ Thermally Enhanced Package application note. If the PowerPAD is not soldered to the PCB, then the thermal impedance increases substantially, which can cause serious heat and performance issues. Be sure to always solder the PowerPAD to the PCB to optimize performance.

When determining whether or not the device satisfies the maximum power-dissipation requirement, consider not only quiescent power dissipation, but also dynamic power dissipation. Often times, ynamic power dissipation is difficult to quantify because the signal pattern is inconsistent, but an estimate of the RMS power dissipation can provide visibility into a possible problem.