ZHCSLK9 July   2021 TCAN1046A-Q1

ADVANCE INFORMATION  

  1. 1特性
  2. 2应用
  3. 3说明
  4. 4Pin Configuration and Functions
  5. 5Device and Documentation Support
    1. 5.1 Device Support
      1. 5.1.1 Device Nomenclature
    2. 5.2 接收文档更新通知
    3. 5.3 支持资源
    4. 5.4 Trademarks
    5. 5.5 Electrostatic Discharge Caution
    6. 5.6 术语表

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Pin Configuration and Functions

Figure 4-1 D Package, 14 Pin SOIC, Top View
Figure 4-2 DMT Package, 14 Pin VSON, Top View
Table 4-1 Pin Functions
Pins Type Description
Name No.
TXD1 1 Digital Input CAN transmit data input 1, integrated pull-up
GND1 2 GND1 Ground connection, transceiver 1
VCC1 3 Supply 5-V supply voltage, transceiver 1
RXD1 4 Digital Output CAN receive data output 1, tri-state when VCC < UVVCC
TXD2 5 Digital Input CAN transmit data input 2, integrated pull-up
GND2 6 GND2 Ground connection, transceiver 2
VCC2 7 Supply 5-V supply voltage, transceiver 2
RXD2 8 Digital Output CAN receive data output 2, tri-state when VCC < UVVCC
CANL2 9 Bus IO Low-level CAN bus 2 input/output line
CANH2 10 Bus IO High-level CAN bus 2 input/output line
STB2 11 Digital Input Standby input 2 for mode control, integrated pull-up
CANL1 12 Bus IO Low-level CAN bus 1 input/output line
CANH1 13 Bus IO High-level CAN bus 1 input/output line
STB1 14 Digital Input Standby input 1 for mode control, integrated pull-up
Thermal Pad (VSON only) — Electrically connected to GND, connect the thermal pad to the printed circuit board (PCB) ground plane for thermal relief