ZHCSP01 July   2022 TCAL9539

ADVANCE INFORMATION  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 I2C Bus Timing Requirements
    8. 6.8 Switching Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 I/O Port
      2. 8.3.2 Adjustable Output Drive Strength
      3. 8.3.3 Interrupt Output (INT)
      4. 8.3.4 Reset Input (RESET)
      5. 8.3.5 Software Reset Call
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-On Reset
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
    6. 8.6 Register Maps
      1. 8.6.1 Device Address
      2. 8.6.2 Control Register and Command Byte
      3. 8.6.3 Register Descriptions
      4. 8.6.4 Bus Transactions
        1. 8.6.4.1 Writes
        2. 8.6.4.2 Reads
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Minimizing ICC When I/Os Control LEDs
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Power-On Reset Requirements
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 接收文档更新通知
    2. 10.2 支持资源
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 术语表
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information
    2. 11.2 Mechanical Data

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC (1) Package UNIT
PW (TSSOP) RTW (WQFN)
PINS PINS
RθJA Junction-to-ambient thermal resistance
101.4
47.1		 °C/W
RθJC(top) Junction-to-case (top) thermal resistance
45.2
41.2		 °C/W
RθJB Junction-to-board thermal resistance
56.6
26.6		 °C/W
ΨJT Junction-to-top characterization parameter
6.9
2.2		 °C/W
ΨJB Junction-to-board characterization parameter
56.2
26.5		 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance NA
15.8		 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.