ZHCSFZ6 December   2016 TAS6422-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 说明（续）
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Typical Characteristics
  9. 9 Parameter measurement Information
  10. 10Detailed description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1  Serial Audio Port
        1. 10.3.1.1 I2S Mode
        2. 10.3.1.2 Left-Justified Timing
        3. 10.3.1.3 Right-Justified Timing
        4. 10.3.1.4 TDM Mode
        5. 10.3.1.5 Supported Clock Rates
        6. 10.3.1.6 Audio-Clock Error Handling
      2. 10.3.2  High-Pass Filter
      3. 10.3.3  Volume Control and Gain
      4. 10.3.4  High-Frequency Pulse-Width Modulator (PWM)
      5. 10.3.5  Gate Drive
      6. 10.3.6  Power FETs
      7. 10.3.7  Load Diagnostics
        1. 10.3.7.1 DC Load Diagnostics
        2. 10.3.7.2 Line Output Diagnostics
        3. 10.3.7.3 AC Load Diagnostics
      8. 10.3.8  Protection and Monitoring
        1. 10.3.8.1 Overcurrent Limit (ILIMIT)
        2. 10.3.8.2 Overcurrent Shutdown (ISD)
        3. 10.3.8.3 DC Detect
        4. 10.3.8.4 Clip Detect
        5. 10.3.8.5 Global Overtemperature Warning (OTW), Overtemperature Shutdown (OTSD)
        6. 10.3.8.6 Channel Overtemperature Warning [OTW(i)] and Shutdown [OTSD(i)]
        7. 10.3.8.7 Undervoltage (UV) and Power-On-Reset (POR)
        8. 10.3.8.8 Overvoltage (OV) and Load Dump
      9. 10.3.9  Power Supply
        1. 10.3.9.1 Vehicle-Battery Power-Supply Sequence
        2. 10.3.9.2 Boosted Power-Supply Sequence
      10. 10.3.10 Hardware Control Pins
        1. 10.3.10.1 FAULT
        2. 10.3.10.2 WARN
        3. 10.3.10.3 MUTE
        4. 10.3.10.4 STANDBY
    4. 10.4 Device Functional Modes
      1. 10.4.1 Operating Modes and Faults
    5. 10.5 Programming
      1. 10.5.1 I2C Serial Communication Bus
      2. 10.5.2 I2C Bus Protocol
      3. 10.5.3 Random Write
      4. 10.5.4 Sequential Write
      5. 10.5.5 Random Read
      6. 10.5.6 Sequential Read
    6. 10.6 Register Maps
      1. 10.6.1  Mode Control Register (address = 0x00) [default = 0x00]
      2. 10.6.2  Miscellaneous Control 1 Register (address = 0x01) [default = 0x32]
      3. 10.6.3  Miscellaneous Control 2 Register (address = 0x02) [default = 0x62]
      4. 10.6.4  SAP Control (Serial Audio-Port Control) Register (address = 0x03) [default = 0x04]
      5. 10.6.5  Channel State Control Register (address = 0x04) [default = 0x55]
      6. 10.6.6  Channel 1 Through 2 Volume Control Registers (address = 0x05-0x06) [default = 0xCF]
      7. 10.6.7  DC Load Diagnostic Control 1 Register (address = 0x09) [default = 0x00]
      8. 10.6.8  DC Load Diagnostic Control 2 Register (address = 0x0A) [default = 0x11]
      9. 10.6.9  DC Load Diagnostic Report 1 Register (address = 0x0C) [default = 0x00]
      10. 10.6.10 DC Load Diagnostics Report 3 Line Output Register (address = 0x0E) [default = 0x00]
      11. 10.6.11 Channel State Reporting Register (address = 0x0F) [default = 0x55]
      12. 10.6.12 Channel Faults (Overcurrent, DC Detection) Register (address = 0x10) [default = 0x00]
      13. 10.6.13 Global Faults 1 Register (address = 0x11) [default = 0x00]
      14. 10.6.14 Global Faults 2 Register (address = 0x12) [default = 0x00]
      15. 10.6.15 Warnings Register (address = 0x13) [default = 0x20]
      16. 10.6.16 Pin Control Register (address = 0x14) [default = 0x00]
      17. 10.6.17 AC Load Diagnostic Control 1 Register (address = 0x15) [default = 0x00]
      18. 10.6.18 AC Load Diagnostic Control 2 Register (address = 0x16) [default = 0x00]
      19. 10.6.19 AC Load Diagnostic Impedance Report Ch1 through CH2 Registers (address = 0x17-0x18) [default = 0x00]
      20. 10.6.20 AC Load Diagnostic Phase Report High Register (address = 0x1B) [default = 0x00]
      21. 10.6.21 AC Load Diagnostic Phase Report Low Register (address = 0x1C) [default = 0x00]
      22. 10.6.22 AC Load Diagnostic STI Report High Register (address = 0x1D) [default = 0x00]
      23. 10.6.23 AC Load Diagnostic STI Report Low Register (address = 0x1E) [default = 0x00]
      24. 10.6.24 Miscellaneous Control 3 Register (address = 0x21) [default = 0x00]
      25. 10.6.25 Clip Control Register (address = 0x22) [default = 0x01]
      26. 10.6.26 Clip Window Register (address = 0x23) [default = 0x14]
      27. 10.6.27 Clip Warning Register (address = 0x24) [default = 0x00]
      28. 10.6.28 ILIMIT Status Register (address = 0x25) [default = 0x00]
      29. 10.6.29 Miscellaneous Control 4 Register (address = 0x26) [default = 0x40]
  11. 11Application and Implementation
    1. 11.1 Application Information
      1. 11.1.1 AM-Radio Band Avoidance
      2. 11.1.2 Parallel BTL Operation (PBTL)
      3. 11.1.3 Demodulation Filter Design
      4. 11.1.4 Line Driver Applications
    2. 11.2 Typical Application
      1. 11.2.1 BTL Application
        1. 11.2.1.1 Design Requirements
        2. 11.2.1.2 Communication
        3. 11.2.1.3 Detailed Design Procedure
          1. 11.2.1.3.1 Hardware Design
          2. 11.2.1.3.2 Digital Input and the Serial Audio Port
          3. 11.2.1.3.3 Bootstrap Capacitors
          4. 11.2.1.3.4 Output Reconstruction Filter
        4. 11.2.1.4 Application Curves
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
      1. 13.1.1 Electrical Connection of Thermal pad and Heat Sink
      2. 13.1.2 EMI Considerations
      3. 13.1.3 General Guidelines
    2. 13.2 Layout Example
    3. 13.3 Thermal Considerations
  14. 14器件和文档支持
    1. 14.1 文档支持
      1. 14.1.1 相关文档
    2. 14.2 接收文档更新通知
    3. 14.3 社区资源
    4. 14.4 商标
    5. 14.5 静电放电警告
    6. 14.6 Glossary
  15. 15机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

14 器件和文档支持

14.1 文档支持

14.1.1 相关文档

请参阅如下相关文档：

14.2 接收文档更新通知

要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。请单击右上角的通知我 进行注册，即可收到任意产品信息更改每周摘要。有关更改的详细信息，请查看任意已修订文档中包含的修订历史记录。

14.3 社区资源

下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅 TI 的 《使用条款》。

    TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在 e2e.ti.com 中，您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
    E2E 音频放大器论坛 TI 的音频放大器工程师对工程师 (E2E) 社区此社区的创建目的在于促进工程师之间的协作。用户可进行实时问答。

14.4 商标

PowerPAD, 《PurePath, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

14.5 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

14.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.