ZHCSB75E May   2013  – June 2016 TAS5729MD

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 描述
  4. 4 修订历史记录
  5. 5 Related Devices
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Digital I/O Pins
    6. 7.6  Master Clock
    7. 7.7  Serial Audio Port
    8. 7.8  Protection Circuitry
    9. 7.9  Speaker Amplifier in All Modes
    10. 7.10 Speaker Amplifier in Stereo Bridge Tied Load (BTL) Mode
    11. 7.11 Speaker Amplifier in Stereo Post-Filter Parallel Bridge Tied Load (Post-Filter PBTL) Mode
    12. 7.12 Headphone Amplifier and Line Driver
    13. 7.13 Reset Timing
    14. 7.14 I2C Control Port
    15. 7.15 Typical Electrical Power Consumption
    16. 7.16 Typical Characteristics
      1. 7.16.1 Speaker Amplifier
      2. 7.16.2 Headphone Amplifier
      3. 7.16.3 Line Driver
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Power Supply
      2. 9.3.2  ADR/SPK_FAULT
      3. 9.3.3  Device Protection System
        1. 9.3.3.1 Overcurrent (OC) Protection With Current Limiting
        2. 9.3.3.2 Overtemperature Protection
        3. 9.3.3.3 Undervoltage Error (UVE) and Power-On Reset (POR)
      4. 9.3.4  Clock, Auto Detection, and PLL
      5. 9.3.5  Serial Data Interface
      6. 9.3.6  PWM Section
      7. 9.3.7  I2C Compatible Serial Control Interface
      8. 9.3.8  Serial Interface Control And Timing
        1. 9.3.8.1 I2S Timing
        2. 9.3.8.2 Left-Justified
        3. 9.3.8.3 Right-Justified
      9. 9.3.9  Automatic Gain Limiting (AGL)
      10. 9.3.10 PWM Level Meter
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device Protection Mode
      2. 9.4.2 Speaker Amplifier Mode
        1. 9.4.2.1 Stereo Mode
        2. 9.4.2.2 Monaural Mode
      3. 9.4.3 Headphone/Line Amplifier
    5. 9.5 Programming
      1. 9.5.1 I2C Serial Control Interface
        1. 9.5.1.1 General I2C Operation
        2. 9.5.1.2 Single- and Multiple-Byte Transfers
        3. 9.5.1.3 Single-Byte Write
        4. 9.5.1.4 Multiple-Byte Write
        5. 9.5.1.5 Single-Byte Read
        6. 9.5.1.6 Multiple-Byte Read
      2. 9.5.2 26-Bit 3.23 Number Format
    6. 9.6 Register Maps
      1. 9.6.1  Clock Control Register (0x00)
      2. 9.6.2  Device ID Register (0x01)
      3. 9.6.3  Error Status Register (0x02)
      4. 9.6.4  System Control Register 1 (0x03)
      5. 9.6.5  Serial Data Interface Register (0x04)
      6. 9.6.6  System Control Register 2 (0x05)
      7. 9.6.7  Soft Mute Register (0x06)
      8. 9.6.8  Volume Registers (0x07, 0x08, 0x09)
      9. 9.6.9  Volume Configuration Register (0x0E)
      10. 9.6.10 Modulation Limit Register (0x10)
      11. 9.6.11 Interchannel Delay Registers (0x11, 0x12, 0x13, and 0x14)
      12. 9.6.12 PWM Shutdown Group Register (0x19)
      13. 9.6.13 Start/Stop Period Register (0x1A)
      14. 9.6.14 Oscillator Trim Register (0x1B)
      15. 9.6.15 BKND_ERR Register (0x1C)
      16. 9.6.16 Input Multiplexer Register (0x20)
      17. 9.6.17 Channel 4 Source Select Register (0x21)
      18. 9.6.18 PWM Output MUX Register (0x25)
      19. 9.6.19 AGL Control Register (0x46)
      20. 9.6.20 PWM Switching Rate Control Register (0x4F)
      21. 9.6.21 EQ Control (0x50)
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Stereo BTL Configuration With Headphone and Line Driver Amplifier
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Hardware Integration
          2. 10.2.1.2.2 Control and Software Integration
          3. 10.2.1.2.3 Recommended Start-Up and Shutdown Procedures
            1. 10.2.1.2.3.1 Initialization Sequence
            2. 10.2.1.2.3.2 Normal Operation
            3. 10.2.1.2.3.3 Shutdown Sequence
            4. 10.2.1.2.3.4 Power-Down Sequence
        3. 10.2.1.3 Application Curves for Stereo BTL Configuration with Headphone and Line Driver Amplifier
      2. 10.2.2 Mono PBTL Configuration with Headphone and Line Driver Amplifier
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 DVDD, AVDD, and DRVDD Supplies
    2. 11.2 PVDD Power Supply
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 文档支持
      1. 13.1.1 相关文档
    2. 13.2 接收文档更新通知
    3. 13.3 社区资源
    4. 13.4 商标
    5. 13.5 静电放电警告
    6. 13.6 Glossary
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

13 器件和文档支持

13.1 文档支持

13.1.1 相关文档

13.2 接收文档更新通知

要接收文档更新通知，请访问 www.ti.com.cn 您器件对应的产品文件夹。点击右上角的提醒我 (Alert me) 注册后，即可每周定期收到已更改的产品信息。有关更改的详细信息，请查阅已修订文档的修订历史记录。

13.3 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.4 商标

DirectPath, PowerPAD, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

13.5 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

13.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.