SLRS021E December   1967  – May 2026 SN55451B , SN55452B , SN55453B , SN55454B , SN75451B , SN75452B , SN75453B , SN75454B

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Switching Characteristics, VCC = 5 V, TA = 25°C
    6. 6.6 Dissipation Ratings
    7. 6.7 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|8
  • P|8
  • PS|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.3 Thermal Information

THERMAL METRIC(1) SN7545xB UNIT
D (SOIC) P (PDIP) PS (SO)
8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 122.2 63.7 119.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 68.4 53.6 71.5 °C/W
RθJB Junction-to-board thermal resistance 62.4 40.8 68.7 °C/W
ψJT Junction-to-top characterization parameter 23.2 31.1 31.6 °C/W
ψJB Junction-to-board characterization parameter 62.0 40.8 67.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.