ZHCSTI9D October   1990  – October 2023 SN65175 , SN75175

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Dissipation Rating
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
  10. 9 Device and Documentation Support
    1. 9.1 接收文档更新通知
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • NS|16
  • N|16
  • D|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1) D (SOIC) N (PDIP) NS (SOP) UNIT
16-PINS
R θJA Junction-to-ambient thermal resistance 84.6 60.6 88.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 43.5 48.1 46.2 °C/W
R θJB Junction-to-board thermal resistance 43.2 40.6 50.7 °C/W
ψ JT Junction-to-top characterization parameter 10.4 27.5 13.5 °C/W
ψ JB Junction-to-board characterization parameter 42.8 40.3 50.3 °C/W
R θJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.