SCAS582Q November   1996  – October 2014 SN74LVCHR16245A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Operating Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DGG|48
  • DL|48
  • DGV|48
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Specifications

6.1 Absolute Maximum Ratings(1)

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC Supply voltage range –0.5 6.5 V
VI Input voltage range(2) –0.5 6.5 V
VO Voltage range applied to any output in the high-impedance or power-off state(2) –0.5 6.5 V
VO Voltage range applied to any output in the high or low state(2)(3) –0.5 VCC + 0.5 V
IIK Input clamp current VI < 0 –50 mA
IOK Output clamp current VO < 0 –50 mA
IO Continuous output current ±50 mA
Continuous current through each VCC or GND ±100 mA
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of VCC is provided in the Recommended Operating Conditions table.

6.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) 0 2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) 0 2000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage Operating 1.65 3.6 V
Data retention only 1.5
VIH High-level input voltage VCC = 1.65 V to 1.95 V 0.65 × VCC V
VCC = 2.3 V to 2.7 V 1.7
VCC = 2.7 V to 3.6 V 2
VIL Low-level input voltage VCC = 1.65 V to 1.95 V 0.35 × VCC V
VCC = 2.3 V to 2.7 V 0.7
VCC = 2.7 V to 3.6 V 0.8
VI Input voltage 0 5.5 V
VO Output voltage High or low state 0 VCC V
3-state 0 5.5
IOH High-level output current VCC = 1.65 V –2 mA
VCC = 2.3 V –4
VCC = 2.7 V –8
VCC = 3 V –12
IOL Low-level output current VCC = 1.65 V 2 mA
VCC = 2.3 V 4
VCC = 2.7 V 8
VCC = 3 V 12
Δt/Δv Input transition rise or fall rate 10 ns/V
TA Operating free-air temperature –40 125 °C
(1) All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004).

6.4 Thermal Information

THERMAL METRIC(1) SN74LVCHR16245A UNIT
DGG DGV DL
48 PINS
RθJA Junction-to-ambient thermal resistance 64.3 78.4 68.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 17.6 30.7 34.7
RθJB Junction-to-board thermal resistance 31.5 41.8 41.0
ψJT Junction-to-top characterization parameter 1.1 3.8 12.3
ψJB Junction-to-board characterization parameter 31.2 41.3 40.4
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).

6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP(1) MAX UNIT
VOH IOH = –100 µA 1.65 V to 3.6 V VCC – 0.2 V
IOH = –2 mA 1.65 V 1.2
IOH = –4 mA 2.3 V 1.7
2.7 V 2.2
IOH = –6 mA 3 V 2.4
IOH = –8 mA 2.7 V 2
IOH = –12 mA 3 V 2
VOL IOL = 100 µA 1.65 V to 3.6 V 0.2 V
IOL = 2 mA 1.65 V 0.45
IOL = 4 mA 2.3 V 0.7
2.7 V 0.4
IOL = 6 mA 3 V 0.55
IOL = 8 mA 2.7 V 0.6
IOL = 12 mA 3 V 0.8
II Control inputs VI = 0 to 5.5 V 3.6 V ±5 µA
II(hold) A or B port VI = 0.58 V 1.65 V 15 µA
VI = 1.07 V –15
VI = 0.7 V 2.3 V 45
VI = 1.7 V –45
VI = 0.8 V 3 V 75
VI = 2 V –75
VI = 0 to 3.6 V(2) 3.6 V ±500
Ioff VI or VO = 5.5 V 0 ±10 µA
IOZ(3) VO = 0 V or (VCC to 5.5 V) 2.3 V to 3.6 V ±5 µA
ICC VI = VCC or GND IO = 0 3.6 V 20 µA
3.6 V ≤ VI ≤ 5.5 V(4) 20
ΔICC One input at VCC – 0.6 V, Other inputs at VCC or GND 2.7 V to 3.6 V 500 µA
Ci Control inputs VI = VCC or GND 3.3 V 3 pF
Cio A or B port VO = VCC or GND 3.3 V 12 pF
(1) All typical values are at VCC = 3.3 V, TA = 25°C.
(2) This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another.
(3) For the total leakage current in an I/O port, please consult the II(hold) specification for the input voltage condition 0 V < VI < VCC, and the IOZ specification for the input voltage conditions VI = 0 V or VI = VCC to 5.5 V. The bus-hold current, at input voltages greater than VCC, is negligible.
(4) This applies in the disabled state only.

6.6 Switching Characteristics

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 VCC = 1.8 V
± 0.15 V		 VCC = 2.5 V
± 0.2 V		 VCC = 2.7 V VCC = 3.3 V
± 0.3 V		 UNIT
MIN MAX MIN MAX MIN MAX MIN MAX
tpd A or B B or A 1 12.5 1 9.5 1 5.7 1.5 4.8 ns
ten OE A or B 1 15.8 1 12.2 1 7.9 1.5 6.3 ns
tdis OE A or B 1 19.2 1 11.9 1 8.3 2.2 7.4 ns

6.7 Operating Characteristics

TA = 25°C
PARAMETER TEST
CONDITIONS		 VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V UNIT
TYP TYP TYP
Cpd Power dissipation capacitance
per transceiver		 Outputs enabled f = 10 MHz 36 36 39 pF
Outputs disabled 3 3 4

6.8 Typical Characteristics

D001_SCAS582.gifFigure 1. TPD vs VCC
D002_SCAS582.gifFigure 2. TPD vs Temperature