SCES213Y April   1999  – August 2026 SN74LVC1G02

PRODUCTION DATA  

  1.   1
  2.   2
  3. 1 Features
  4. 2 Applications
  5. 3 Description
  6. 4 Pin Configuration and Functions
  7. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, CL = 15pF
    7. 5.7  Switching Characteristics, –40°C to 85°C
    8. 5.8  Switching Characteristics, –40°C to 125°C
    9. 5.9  Operating Characteristics
    10. 5.10 Typical Characteristics
  8. 6 Parameter Measurement Information
  9. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 Partial Power Down (Ioff)
      3. 7.3.3 Standard CMOS Inputs
      4. 7.3.4 Clamp Diode Structure
      5. 7.3.5 Over-Voltage Tolerant Inputs
    4. 7.4 Device Functional Modes
  10. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  11. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  12.   50
  13. 10Revision History
  14. 11Mechanical, Packaging, and Orderable Information

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5.4 Thermal Information

PACKAGE PINS THERMAL METRIC(1) UNIT
RθJA RθJC(top) RθJB ΨJT ΨJB RθJC(bot)
DBV (SOT-23) 5 357.1 263.7 264.4 195.6 262.2 - °C/W
DCK (SOT-SC70) 5 371 297.5 258.6 195.6 256.2 - °C/W
DRL (SOT-5X3) 5 364.1 280.6 261.5 195.6 259.2 - °C/W
DRY (SON) 6 439 277 271 84 271 – °C/W
YZP (DSBGA) 5 130 54 51 1 50 – °C/W
DPW (X2SON) 5 340 215 294 41 294 250 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.