SCES213Y
April 1999 – August 2026
SN74LVC1G02
PRODUCTION DATA
1
2
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Switching Characteristics, CL = 15pF
5.7
Switching Characteristics, –40°C to 85°C
5.8
Switching Characteristics, –40°C to 125°C
5.9
Operating Characteristics
5.10
Typical Characteristics
6
Parameter Measurement Information
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Balanced CMOS Push-Pull Outputs
7.3.2
Partial Power Down (Ioff)
7.3.3
Standard CMOS Inputs
7.3.4
Clamp Diode Structure
7.3.5
Over-Voltage Tolerant Inputs
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.1.1
Power Considerations
8.2.1.2
Input Considerations
8.2.1.3
Output Considerations
8.2.2
Detailed Design Procedure
8.2.3
Application Curves
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Documentation Support
9.1.1
Related Documentation
9.2
Receiving Notification of Documentation Updates
9.3
Support Resources
9.4
Trademarks
9.5
Electrostatic Discharge Caution
9.6
Glossary
50
10
Revision History
11
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
DRY|6
MPDS221F
DRL|5
MPDS158G
DSF|6
MPDS301G
DPW|5
MPSS088
DCK|5
MPDS025K
YZP|5
MXBG018L
DBV|5
MPDS018T
散热焊盘机械数据 (封装 | 引脚)
DRY|6
QFND138E
DPW|5
QFND567C
订购信息
sces213y_oa
sces213y_pm
9.6
Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.