ZHCSNX7F
December 1982 – April 2021
SN54HC32
,
SN74HC32
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information - 74
6.5
Thermal Information - 54
6.6
Electrical Characteristics - 74
6.7
Electrical Characteristics - 54
6.8
Switching Characteristics - 74
6.9
Switching Characteristics - 54
6.10
Operating Characteristics
6.11
Typical Characteristics
7
Parameter Measurement Information
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Balanced CMOS Push-Pull Outputs
8.3.2
Standard CMOS Inputs
8.3.3
Clamp Diode Structure
8.4
Device Functional Modes
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.1.1
Power Considerations
9.2.1.2
Input Considerations
9.2.1.3
Output Considerations
9.2.2
Detailed Design Procedure
9.2.3
Application Curves
Power Supply Recommendations
9
Layout
9.1
Layout Guidelines
9.2
Layout Example
10
Device and Documentation Support
10.1
Documentation Support
10.1.1
Related Documentation
10.2
Related Links
10.3
支持资源
10.4
Trademarks
10.5
静电放电警告
10.6
术语表
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
N|14
MPDI002C
PW|14
MPDS360
NS|14
MSOP002A
D|14
MPDS177G
DB|14
MSSO002E
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsnx7f_oa
zhcsnx7f_pm
10.5
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。