ZHCSXW4I July   2004  – February 2025 SN74AVCH2T45

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configurations and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics: VCCA = 1.2V
    7. 5.7  Switching Characteristics: VCCA = 1.5V
    8. 5.8  Switching Characteristics: VCCA = 1.8V
    9. 5.9  Switching Characteristics: VCCA = 2.5V
    10. 5.10 Switching Characteristics: VCCA = 3.3V
    11. 5.11 Operating Characteristics
    12. 5.12 Typical Characteristics
      1. 5.12.1 Typical Propagation Delay (A to B) vs Load Capacitance, TA = 25°C, VCCA = 1.8V
      2. 5.12.2 Typical Propagation Delay (A to B) vs Load Capacitance, TA = 25°C, VCCA = 2.5V
      3. 5.12.3 Typical Propagation Delay (A to B) vs Load Capacitance, TA = 25°C, VCCA = 3.3V
  7. 6 Parameter Measurement Information
    1. 6.1 23
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 VCC Isolation
      2. 7.3.2 2-Rail Design
      3. 7.3.3 IO Ports are 4.6 V Tolerant
      4. 7.3.4 Partial Power Down Mode
      5. 7.3.5 Bus Hold on Data Inputs
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Unidirectional Logic Level-Shifting Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Bidirectional Logic Level-Shifting Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Enable Times
        3. 8.2.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DCU|8
  • YZP|8
  • DCT|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

10 Revision History

Changes from Revision H (April 2015) to Revision I (February 2025)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • Updated DCT and DCU Thermal Information Go
  • Added the Receiving Notifications of Documentation Updates, Support Resources, Electrostatic Discharge Caution, and Glossary sectionsGo

Changes from Revision G (April 2015) to Revision H (April 2015)

  • 添加了其他应用Go
  • Updated Overview section. Go
  • Updated Layout Guidelines section. Go

Changes from Revision F (November 2007) to Revision G (February 2015)

  • 添加了 ESD 等级 表、特性说明 部分、器件功能模式、应用和实现 部分、电源相关建议 部分、布局 部分、器件和文档支持 部分以及机械、封装和可订购信息 部分Go