ZHCSS64P 数据表 | 德州仪器 TI.com.cn

ZHCSS64P October 1995 – October 2023 SN54AHCT86 , SN74AHCT86

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		SNx4AHCT86								UNIT
		D	DB	DGV	N	NS	PW	RGY	BQA
		14 PINS
R_θJA	Junction-to-ambient thermal resistance	124.5	109.5	133.3	59.7	92.2	147.7	59.0	88.3	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	78.8	62.1	55.6	47.3	49.8	77.4	72.5	90.9
R_θJB	Junction-to-board thermal resistance	81	56.9	66.3	39.5	51.0	90.9	35.0	56.8
ψ_JT	Junction-to-top characterization parameter	37	22.6	7.8	32.4	15.7	27.2	3.9	9.9
ψ_JB	Junction-to-board characterization parameter	80.6	56.3	56.6	39.4	50.6	90.2	35.1	56.7
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	N/A	N/A	N/A	15.4	33.4

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).