ZHCSHV8B August   2009  – March 2015 SN65LVDS93A

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      使用分立式 LVDS TX 的 RGB 视频系统
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions - TSSOP
    2.     Pin Functions - BGA MICROSTAR
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 TTL Input Data
      2. 9.3.2 LVDS Output Data
    4. 9.4 Device Functional Modes
      1. 9.4.1 Input Clock Edge
      2. 9.4.2 Low Power Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Power
        2. 10.2.2.2 Signal Connectivity
        3. 10.2.2.3 PCB Routing
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Board Stackup
      2. 12.1.2 Power and Ground Planes
      3. 12.1.3 Traces, Vias, and Other PCB Components
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 文档支持
      1. 13.1.1 相关文档
    2. 13.2 接收文档更新通知
    3. 13.3 社区资源
    4. 13.4 商标
    5. 13.5 静电放电警告
    6. 13.6 Glossary
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1) SN65LVDS93B UNIT
DGG (TSSOP)
56 PINS
RθJA Junction-to-ambient thermal resistance 62.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 18.4 °C/W
RθJB Junction-to-board thermal resistance 31.1 °C/W
ΨJT Junction-to-top characterization parameter 0.8 °C/W
ΨJB Junction-to-board characterization parameter 30.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.