ZHCSKH4A October   2006  – November 2019 SN65LBC174A-EP

PRODUCTION DATA.  

  1. 1特性
  2. 2应用
  3. 3说明
    1.     Device Images
      1.      逻辑图（正逻辑）
  4. 4修订历史记录
  5. 5说明 （续）
    1. 5.1 Pin Configuration and Functions
      1.      Pin Functions
    2. 5.2 Specifications
      1. 5.2.1 Absolute Maximum Ratings
      2. 5.2.2 ESD Ratings
      3. 5.2.3 Recommended Operating Conditions
      4. 5.2.4 Thermal Information
      5. 5.2.5 Electrical Characteristics
      6. 5.2.6 Switching Characteristics
      7. 5.2.7 Typical Characteristics
    3. 5.3 Parameter Measurement Information
    4. 5.4 Detailed Description
      1. 5.4.1 Overview
      2. 5.4.2 Functional Block Diagram
      3. 5.4.3 Feature Description
      4. 5.4.4 Device Functional Modes
    5. 5.5 Application and Implementation
      1. 5.5.1 Application Information
      2. 5.5.2 Typical Application
        1. 5.5.2.1 Design Requirements
        2. 5.5.2.2 Detailed Design Procedure
        3. 5.5.2.3 Application Curve
    6. 5.6 Power Supply Recommendations
    7. 5.7 Layout
      1. 5.7.1 Layout Guidelines
      2. 5.7.2 Layout Example
  6. 6器件和文档支持
    1. 6.1 接收文档更新通知
    2. 6.2 支持资源
    3. 6.3 商标
    4. 6.4 静电放电警告
    5. 6.5 Glossary
  7. 7机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.2.4 Thermal Information

THERMAL METRIC(1) SN65LBC174A-EP UNIT
DW (SOIC)
20 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 61.3 60.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 26.2 24.3 °C/W
RθJB Junction-to-board thermal resistance 29.3 26.1 °C/W
ψJT Junction-to-top characterization parameter 4.9 4.1 °C/W
ψJB Junction-to-board characterization parameter 28.8 25.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.