ZHCSUM3C March   2007  – February 2024 SN65C1167E , SN65C1168E

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Driver Output and Receiver Input ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Driver Section Electrical Characteristics
    6. 5.6 Receiver Section Electrical Characteristics
    7. 5.7 Driver Section Switching Characteristics
    8. 5.8 Receiver Section Switching Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Active High Driver Output Enables
      2. 7.3.2 Active Low Receiver Enables
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1)SN65C116xEUNIT
SO (NS)PW (TSSOP)RGY (VQFN)
16 PINS16 PINS16 PINS
RθJAJunction-to-ambient thermal resistance88.5107.548.4°C/W
RθJC(top)Junction-to-case (top) thermal resistance46.238.446.4°C/W
RθJBJunction-to-board thermal resistance50.753.724.6°C/W
ψJTJunction-to-top characterization parameter13.53.22.3°C/W
ψJBJunction-to-board characterization parameter50.353.124.5°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistancen/an/a8.5°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.