ZHCSOI2H
July 1985 – December 2021
SN65176B
,
SN75176B
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
Recommended Operating Conditions
6.3
Thermal Information
6.4
Electrical Characteristics – Driver
6.5
Electrical Characteristics – Receiver
6.6
Switching Characteristics – Driver
6.7
Switching Characteristics – Receiver
6.8
Typical Characteristics
Parameter Measurement Information
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Driver
7.3.2
Receiver
7.4
Device Functional Modes
7.4.1
Device Powered
7.4.2
Device Unpowered
7.4.3
Symbol Cross Reference
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curves
8.3
System Examples
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Related Links
11.2
Trademarks
11.3
静电放电警告
11.4
术语表
12
Mechanical, Packaging, and Orderable Information
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
D|8
P|8
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsoi2h_oa
zhcsoi2h_pm
11.3
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。